Electrostatic Chuck Double-Sealing Against Bonding Layer Gas Infiltration
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Solution Overview
Problem
The existing electrostatic chuck devices face issues with processing gases infiltrating through fine gaps in the sealing members, leading to corrosion or etching of the bonding layer, which reduces processing yield and increases the risk of contamination and hot spots.
Innovation Solution
A double-sealing structure is implemented, comprising a covering member that completely covers the bonding layer to prevent gas infiltration and a sealing member that protects the bonding layer from damage, ensuring a hermetic seal and improved durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing member is disposed on the periphery of the bonding layer, then the bonding layer is protected from direct exposure to processing gas, but fine gaps are formed in the sealing member allowing gas infiltration
Solution Approach 1:
The sealing structure is divided into two separate components: a sealing member disposed on the periphery of the bonding layer, and a covering member covering the bonding layer. This segmentation allows each component to perform its specific function - the sealing member provides peripheral protection while the covering member prevents gas infiltration through complete coverage, eliminating the fine gap problem that occurs with a single sealing structure.
Solution Approach 2:
The covering member is positioned to cover the bonding layer and is surrounded by the sealing member, creating a nested configuration. The covering member fits within the space defined by the sealing member, forming a double-sealing structure where the inner covering member provides primary protection and the outer sealing member provides secondary protection, ensuring complete sealing without gaps.
2Device complexity
If a single sealing member is used to protect the bonding layer, then the structure is simple, but the sealing is incomplete allowing processing gas to infiltrate
Solution Approach 1:
The sealing function is segmented into two distinct members: the sealing member that provides peripheral support and the covering member that provides complete coverage. This segmentation achieves hermetic sealing without requiring an overly complex single-component design, as each component is optimized for its specific role.
Solution Approach 2:
The double-sealing structure combines two different sealing components (sealing member and covering member) made from materials optimized for their respective functions. The sealing member uses materials with strong etch resistance, while the covering member uses materials that provide complete coverage and prevention of gas infiltration, creating a composite sealing system that achieves hermetic sealing.
3Area of stationary object
If the sealing member is stretched to cover the bonding layer, then coverage is achieved, but fine gaps are formed reducing seal effectiveness
Solution Approach 1:
The sealing function is divided between two members to avoid the problem of stretching a single sealing member. The covering member is designed to cover the bonding layer without stretching, while the sealing member is positioned on the periphery to provide support, eliminating the formation of fine gaps that would reduce seal integrity.
Data Source
AI summary
A substrate processing apparatus and a method of fabricating the same are proposed. A bonding layer, by which a chuck body and a base plate of an electrostatic chuck device are bonded, is completely covered using a double-sealing structure in which a covering member for preventing a processing gas from infiltrating into the bonding layer and a sealing member for preventing the bonding layer from being damaged are bonded to each other. The durability and the efficiency of the operation of the electrostatic chuck device are improved.