Electrostatic Chuck Clamp Structure to Prevent Substrate Edge Damage

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Solution Overview

Problem

Existing deposition technologies fail to prevent substrate damage during the deposition process.

Innovation Solution

A deposition apparatus and method that includes a support, clamp, and electrostatic chuck with protrusions and grooves to prevent substrate damage during deposition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the electrostatic chuck is disposed directly on the substrate to secure the substrate during deposition, then the substrate can be firmly held, but the substrate edge may contact the electrostatic chuck and cause damage

Engineering Contradiction:

Improvesubstrate fixation stabilityVSAvoidsubstrate edge damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The clamp serves as an intermediary component between the electrostatic chuck and the substrate edge. The electrostatic chuck holds the clamp, and the clamp in turn secures the substrate, preventing direct contact between the electrostatic chuck and substrate edge while maintaining firm fixation

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The substrate fixation function is divided into two separate components: the electrostatic chuck for holding the main substrate body and the clamp for securing the substrate edge. This segmentation allows each component to perform its specific function without causing damage

Inventive Principle:

Principle #1Segmentation

2Productivity

If the substrate edge is exposed during deposition, then the deposition process can proceed, but the substrate edge is vulnerable to damage from the electrostatic chuck

Engineering Contradiction:

Improvedeposition process efficiencyVSAvoidsubstrate edge damage risk

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The clamp acts as a protective intermediary that allows the deposition process to proceed while shielding the substrate edge from direct contact with the electrostatic chuck, eliminating the damage risk without hindering deposition productivity

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus and method effectively prevent substrate damage by allowing the substrate edge to be contained within grooves, preventing contact with the electrostatic chuck and maintaining substrate integrity.

Implementation Method 1

an electrostatic chuck including a flat part and a plurality of protrusions

Methodology Applied

Scientific EffectElectrostatic force: Electrostatics

Data Source

PatentEP4675004A1Deposition apparatus and deposition method using the same

Publication Date: 2026.01.07 SAMSUNG DISPLAY CO LTD

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AI summary

A deposition apparatus includes: a support, which is disposed on a bottom surface of a substrate to overlap an edge of the substrate in a plan view; a clamp disposed on the support and the edge of the substrate; and an electrostatic chuck including a flat part and a plurality of protrusions, where the flat part is configured to be disposed on a top surface of the substrate and the plurality of protrusions protrude from an edge of the flat part. A part of the clamp is disposed between protrusions adjacent to each other among the plurality of protrusions, and a groove is defined in a bottom surface of each of the plurality of protrusions and configured to overlap the edge of the substrate in the plan view.