Electrostatic Chuck Groove Layout for Uniform Edge Ring Cooling

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Solution Overview

Problem

Existing substrate-processing apparatuses face challenges in achieving in-plane uniformity of the attracting force for electrostatically attracting annular members, leading to unstable temperature control and vibrations of the edge ring.

Innovation Solution

Incorporating a diffusion groove with an annular groove and radial grooves in the electrostatic chuck, which diffuses heat transfer gas into the gap between the annular member and the support surface, ensuring uniform capacitance and improved attracting force distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat transfer gas is supplied to the gap between the annular member and support surface, then temperature control is improved, but in-plane uniformity of attracting force deteriorates

Engineering Contradiction:
Improvetemperature controlVSAvoidin-plane uniformity of attracting force
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The diffusion groove is divided into a circumferential groove and multiple radial grooves that extend from the circumferential groove toward the center. This segmentation allows heat transfer gas to be distributed more uniformly across the gap between the annular member and support surface, improving temperature control while maintaining attracting force uniformity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The radial grooves are positioned to extend from the circumferential groove toward the center of the electrostatic chuck, creating localized gas distribution zones. This local quality approach ensures that heat transfer gas reaches specific regions uniformly, improving overall temperature distribution without compromising the in-plane uniformity of the attracting force.

Inventive Principle:
Principle #3Local quality

2Temperature

If heat transfer gas is supplied to the gap between the annular member and support surface, then cooling effect is improved, but vibrations of the edge ring occur

Engineering Contradiction:
Improvecooling uniformityVSAvoidvibrations
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

By dividing the diffusion groove into circumferential and radial components, the gas flow is distributed more evenly, reducing localized pressure changes that cause vibrations. This segmentation allows cooling to be achieved uniformly without inducing harmful vibrations in the edge ring.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The groove configuration changes the flow parameters of the heat transfer gas, directing it through a controlled path that reduces turbulence and pressure fluctuations. This parameter optimization achieves effective cooling while minimizing vibrations.

Inventive Principle:
Principle #35Parameter changes

3Temperature

If diffusion groove is added to the support surface, then heat transfer gas distribution is improved, but device complexity increases

Engineering Contradiction:
Improveheat transfer gas distributionVSAvoidstructure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The diffusion groove structure merges the circumferential groove and radial grooves into a single integrated feature on the support surface. This combination achieves improved heat transfer gas distribution without requiring separate components, thus limiting the increase in device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The diffusion groove serves multiple functions: it distributes heat transfer gas uniformly, maintains attracting force uniformity, and reduces vibrations. This multi-functionality reduces the need for additional components, offsetting the complexity introduced by the groove structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the in-plane uniformity of the attracting force, stabilizes temperature control of the edge ring, and reduces vibrations, resulting in improved cooling uniformity and operational stability.

Implementation Method 1

a diffusion groove through which a heat transfer gas is diffused into a gap between the annular member and the support surface

Methodology Applied
Scientific EffectDiffusion: Diffusion

Implementation Method 2

an electrostatic chuck, the electrostatic chuck including a support surface configured to support an annular member

Methodology Applied
Scientific EffectElectrostatic attraction: Electrostatics

Data Source

PatentUS20250006541A1Substrate-processing apparatus
Publication Date: 2025.01.02 TOKYO ELECTRON LTD
  • US20250006541A1 patent drawing
  • US20250006541A1 patent drawing
  • US20250006541A1 patent drawing

AI summary

A substrate-processing apparatus includes a substrate support that includes an electrostatic chuck, the electrostatic chuck including a support surface configured to support an annular member. The support surface includes a diffusion groove through which a heat transfer gas is diffused into a gap between the annular member and the support surface. The diffusion groove includes an annular groove provided concentrically with the electrostatic chuck; and a radial groove that is in communication with the annular groove and is provided from the annular groove in a radial direction of the electrostatic chuck.