Electrostatic Chuck Groove Layout for Edge Ring Discharge Control
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Solution Overview
Problem
Existing plasma processing apparatuses face challenges in efficiently diffusing heat transfer gas to the edge ring of the substrate support, leading to potential abnormal discharges and inefficient heat transfer.
Innovation Solution
The apparatus incorporates a groove structure in the ring support surface and lower surface of the edge ring, with varying groove depths and widths to promote uniform gas diffusion and reduce the risk of abnormal discharges, enhancing heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a groove structure is formed in the ring support surface to diffuse heat transfer gas, then heat transfer efficiency is improved, but the device complexity increases
Solution Approach 1:
The groove structure is designed with varying depths in different regions: a first groove with greater depth is formed in a first region, while a second groove with lesser depth is formed in a second region. This local differentiation optimizes heat transfer gas diffusion in specific areas without unnecessarily complicating the entire structure, thereby improving heat transfer efficiency while controlling overall device complexity.
2Temperature
If the groove depth is increased to improve gas diffusion, then heat transfer efficiency is improved, but the risk of abnormal discharge increases
Solution Approach 1:
The groove structure is designed with varying depths in different regions: a first groove with greater depth is formed in a first region, while a second groove with lesser depth is formed in a second region. This local differentiation optimizes heat transfer gas diffusion in specific areas without unnecessarily complicating the entire structure, thereby improving heat transfer efficiency while controlling overall device complexity.
3Ease of manufacture
If a uniform groove structure is used, then manufacturing is simplified, but gas diffusion uniformity is poor
Solution Approach 1:
The groove structure is designed with varying depths in different regions: a first groove with greater depth is formed in a first region, while a second groove with lesser depth is formed in a second region. This local differentiation optimizes heat transfer gas diffusion in specific areas, achieving more uniform gas distribution across the ring support surface while maintaining reasonable manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The groove structure improves heat transfer efficiency and reduces the likelihood of abnormal discharges, ensuring stable plasma processing by optimizing gas distribution around the edge ring.
Implementation Method 1
a groove in which a heat transfer gas is diffused is formed in at least one of the ring support surface or a lower surface of the edge ring
Implementation Method 2
The substrate support has an electrostatic chuck for holding the substrate
Data Source
AI summary
A substrate processing apparatus and an electrostatic chuck for preventing or inhibiting occurrence of abnormal discharge at a lower part of edge ring are provided. Substrate processing apparatus includes: plasma processing chamber; base table situated in plasma processing chamber; electrostatic chuck situated on base table and having substrate support surface and ring support surface; and edge ring situated on ring support surface. Groove in which heat transfer gas is diffused is formed in at least one of ring support surface or lower surface of edge ring. Heat transfer gas supply hole configured to supply heat transfer gas into groove is formed in ring support surface. In annular region including position at which heat transfer gas supply hole is formed, depth of groove in surrounding region around heat transfer gas supply hole is less than depth of groove in region other than surrounding region.