Electrostatic Chuck Partitioning for Wafer Edge Temperature Control
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Solution Overview
Problem
In plasma processing for semiconductor manufacturing, maintaining a uniform temperature across the substrate, particularly in the peripheral areas, is challenging due to difficulties in temperature control compared to the central area.
Innovation Solution
An electrostatic chuck with a disc-shaped plate that supports the substrate using electrostatic force, featuring annular partition walls and supply flow paths for inert gas, allowing for precise temperature control of the substrate's peripheral areas by individually controlling the flow rates of inert gas to each partitioned area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a conventional electrostatic chuck with uniform structure is used, then the substrate can be supported stably, but the temperature distribution becomes non-uniform especially in peripheral areas
Solution Approach 1:
The electrostatic chuck is divided into multiple independent temperature control zones using partition walls. The peripheral portion is segmented into first and second peripheral areas, each with independent inert gas supply flow paths, allowing separate temperature control to achieve uniform temperature distribution across the substrate
Solution Approach 2:
Different regions of the electrostatic chuck are given different temperature control characteristics. The peripheral areas have dedicated supply flow paths and partition structures that enable localized temperature adjustment, while the central area maintains its own temperature control, creating locally optimized temperature zones that collectively achieve overall uniformity
2Temperature
If partition walls are added to divide peripheral areas for temperature control, then temperature uniformity improves, but device complexity increases
Solution Approach 1:
The peripheral portion is divided into manageable segments using partition walls that create first and second peripheral areas. This segmentation allows independent temperature control of each zone while maintaining a relatively simple overall structure that can be manufactured with standard precision
Solution Approach 2:
The partition walls serve multiple functions: they divide the peripheral area into separate temperature zones, provides structural support for the substrate, and guide the flow of inert gas. This multi-functionality reduces the need for additional components, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrostatic chuck enables precise temperature control of the substrate's peripheral areas, improving the uniformity and efficiency of plasma processing by addressing the challenges of temperature distribution in semiconductor manufacturing.
Implementation Method 1
a plate configured to support the substrate using electrostatic force
Data Source
AI summary
Disclosed are an electrostatic chuck capable of precisely controlling the temperature of a peripheral area of a substrate and a plasma processing apparatus including the same. The electrostatic chuck configured to support a substrate in a plasma processing apparatus includes a plate configured to support the substrate using electrostatic force and having a disc shape, a first partition wall formed in an annular shape on a peripheral portion of the plate, a second partition wall formed in an annular shape at a position farther inward than the first partition wall on the peripheral portion of the plate, and a connection partition wall configured to interconnect the first partition wall and the second partition wall to partition the peripheral portion of the plate into a plurality of peripheral areas.