Ultrasonic Electrostatic Chuck Inspection for Electrode Offset Measurement
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Solution Overview
Problem
Conventional methods fail to accurately inspect the area, thickness, and offset of the electrode in electrostatic chucks, which affect substrate separation, and ultrasonic testing is limited to internal crack detection without additional solutions for these measurements.
Innovation Solution
An apparatus and method using ultrasonic waves to measure the electrode area, thickness, and offset of electrostatic chucks by converting reflected signals into ultrasonic voltage signals, adjusting image scales, and calculating spacing and area through ultrasonic inspection units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional inspection methods are used for electrostatic chuck, then internal cracks and pores can be detected, but electrode area, thickness, and offset cannot be measured
Solution Approach 1:
The ultrasonic inspection system is enhanced with additional processing units that enable it to perform multiple functions: not only detecting internal cracks and pores through ultrasonic waves, but also measuring electrode area, thickness, and offset by analyzing reflected signal characteristics. This multi-functional approach resolves the contradiction between reliable defect detection and versatile measurement capabilities.
Solution Approach 2:
The system analyzes changes in ultrasonic wave parameters (reflection intensity, time of flight, frequency) when waves interact with different electrode structures. By monitoring these parameter changes, the system can infer electrode area, thickness, and offset measurements while maintaining its primary defect detection function.
2Measurement precision
If ultrasonic test method is used to calculate offset degree, area, or thickness of electrode, then additional technical solutions are necessary, but conventional methods lack these measurement capabilities
Solution Approach 1:
The patent combines multiple measurement functions (offset detection, area measurement, thickness measurement) into a single integrated ultrasonic inspection system. By merging these functions and sharing common hardware resources (ultrasonic transmitter, receiver, and processing unit), the system achieves precise electrode parameter measurements without proportionally increasing device complexity.
Solution Approach 2:
The system replaces complex mechanical measurement systems with ultrasonic wave-based measurements. Instead of using physical probes or mechanical gauges to measure electrode parameters, the system uses non-contact ultrasonic waves and signal processing to obtain precise measurements, thereby reducing mechanical complexity while maintaining measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise measurement of electrode area, thickness, and offset, ensuring efficient substrate separation and detecting defects in electrostatic chucks, enhancing inspection accuracy.
Implementation Method 1
an ultrasonic sensor unit disposed on the electrostatic chuck, allowing an ultrasonic wave to be incident into the electrostatic chuck, and converting a reflected signal reflected through the electrostatic chuck into an ultrasonic voltage signal
Data Source
AI summary
The apparatus for inspecting the electrostatic chuck for substrate processing includes the electrostatic chuck including a ceramic layer and an electrode layer coupled to an inside of the ceramic layer, an ultrasonic sensor unit disposed on the electrostatic chuck, allowing an ultrasonic wave to be incident into the electrostatic chuck, and converting a reflected signal reflected through the electrostatic chuck into an ultrasonic voltage signal, and an ultrasonic inspection unit to divide the ceramic layer and the electrode layer, based on a size value of the ultrasonic voltage signal.