Electrostatic Chuck Electrode Segmentation for Display Substrate Fixing

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Solution Overview

Problem

Mechanical chucks used in display panel manufacturing, such as LCD and OLED devices, are complex and difficult to control, with vacuum suction strength often being either too weak or too strong, leading to substrate deformation and compromised display quality.

Innovation Solution

An electrostatic chuck with a substrate fixing unit featuring a plurality of electrode patterns insulated from the substrate and spaced apart, which generates an electrostatic force to fix the substrate without overlapping the panel formation region, ensuring optimal adhesion and minimizing electric field distortion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a mechanical chuck using vacuum suction is used to fix the substrate, then the substrate can be held in place, but the suction strength is either too weak to fix the substrate properly or too strong causing substrate deformation

Engineering Contradiction:
Improvesubstrate fixing reliabilityVSAvoidsubstrate deformation
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The substrate fixing unit is divided into multiple electrode patterns (first, second, third, and fourth electrode patterns) arranged in a specific configuration. This segmentation allows different regions of the substrate to experience different electrostatic forces, enabling precise control over the fixing strength and distribution, thereby preventing both insufficient fixing and excessive deformation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies electrostatic force instead of mechanical vacuum suction, changing the physical parameter from pressure-based holding to electric field-based holding. By controlling the voltage applied to the electrode patterns, the adhesion force can be precisely adjusted to match the substrate weight and processing requirements, avoiding both too-weak and too-strong fixing conditions that cause deformation.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If an electrostatic chuck with electrode patterns is used to provide strong adhesion, then substrate fixing reliability is improved, but electric field distortion may occur affecting display quality

Engineering Contradiction:
Improvesubstrate adhesion forceVSAvoiddisplay quality
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

Different electrode patterns are positioned in specific locations relative to the substrate regions. The first and second electrode patterns are positioned to fix the dummy region while the third and fourth electrode patterns fix the panel formation region. This localized arrangement ensures that electrostatic force is applied only where needed for substrate stability, while minimizing electric field distortion in the active display areas, thereby maintaining both adhesion reliability and display quality.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The electrostatic chuck provides a strong and controlled adhesion force, reducing the occurrence of spots on pixels and enhancing display quality by maintaining an undistorted electric field and optimizing the balance between adhesion and electrostatic force.

Implementation Method 1

a substrate fixing unit configured to generate an electrostatic force to fix the substrate W to the stage 310

Methodology Applied
Scientific EffectElectrostatic force: Electrostatics

Implementation Method 2

an insulation layer configured to cover a surface of the electrode patterns 326 and a top surface of the stage 310, the insulation layer insulating the electrode patterns from the substrate W

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS10403536B2Method of fixing substrate using electrostatic chuck and substrate processing apparatus including the same
Publication Date: 2019.09.03 SAMSUNG DISPLAY CO LTD
  • US10403536B2 patent drawing
  • US10403536B2 patent drawing
  • US10403536B2 patent drawing

AI summary

An electrostatic chuck and a substrate processing apparatus including the same are disclosed. In one aspect, the electrostatic chuck includes a stage configured to support a substrate including a panel formation region and a dummy region surrounding the panel formation region. The electrostatic chuck includes a substrate fixing unit including a plurality of electrode patterns insulated from the substrate and spaced apart from one another, the substrate fixing unit at least partially overlapping the dummy region of the substrate and not overlapping the panel formation region of the substrate.