Electrostatic Chuck Embossed Top Plate Gas Delivery
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Solution Overview
Problem
Existing electrostatic chucks for semiconductor substrate processing lack efficient backside gas distribution and particle reduction during processing, which can lead to suboptimal results in material deposition and etching.
Innovation Solution
An electrostatic chuck with an embossed dielectric top plate and a susceptor having cooling channels and raised central support, featuring a plurality of holes for improved gas delivery to the substrate's backside, reducing contact area and particle generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a flat clamping surface is used, then the contact area with the substrate backside is large, but this results in increased particle generation
Solution Approach 1:
The clamping surface is segmented into multiple discrete contact points through embossed protrusions (mesas) rather than a continuous flat surface. This segmentation reduces the total contact area between the chuck and substrate backside, thereby minimizing particle generation while maintaining adequate holding force through distributed contact points.
Solution Approach 2:
The embossed protrusions create localized contact regions with specific geometric properties (height, diameter, spacing) that optimize the balance between holding force and particle reduction. Each protrusion provides a concentrated contact point that minimizes overall contact area while maintaining local pressure for effective substrate retention.
2Temperature
If cooling channels are provided in the susceptor, then cooling capability is improved, but gas distribution to the substrate backside is insufficient
Solution Approach 1:
The raised central support structure acts as an intermediary component between the cooling channels in the susceptor and the substrate backside. It provides a platform for positioning dielectric material with gas-permeable features, enabling efficient transfer of cooling gas from the channels to the substrate while maintaining thermal coupling.
Solution Approach 2:
The dielectric material incorporates porous or gas-permeable features that allow cooling gas to pass through from the susceptor channels to the substrate backside. This porous structure enables uniform gas distribution across the substrate surface while maintaining electrical insulation and thermal management.
3Object-generated harmful factors
If the contact area is reduced to minimize particles, then particle generation decreases, but gas distribution efficiency may be compromised
Solution Approach 1:
The embossed protrusions segment the contact surface into discrete regions, creating controlled gaps between contact points. These gaps serve as pathways for cooling gas to reach the substrate backside, ensuring that reduced contact area does not compromise gas distribution efficiency.
Solution Approach 2:
The raised central support and dielectric material with porous features act as intermediaries that facilitate gas flow through the chuck structure to the substrate backside. This intermediary system ensures efficient gas distribution while maintaining the reduced contact area configuration for particle minimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances backside gas distribution and reduces particle generation by minimizing contact area with the substrate, improving processing outcomes in semiconductor fabrication.
Implementation Method 1
one or more cooling channels formed in an upper surface of the susceptor base... facilitate delivery of a cooling gas... to a backside of the substrate
Implementation Method 2
Electrostatic chucks utilize capacitive and Johnsen-Rahbeck attractive forces for holding the substrate in position
Implementation Method 3
Electrostatic chucks utilize capacitive and Johnsen-Rahbeck attractive forces for holding the substrate in position
Data Source
AI summary
An electrostatic chuck for retaining a substrate is provided herein. In some embodiments, an electrostatic chuck for retaining a substrate may include a susceptor including an electrically conductive susceptor base having one or more cooling channels formed in an upper surface thereof; a raised central support disposed over the one or more cooling channels; and a dielectric top plate disposed on the raised central support, wherein the dielectric top plate has an embossed top surface, and wherein the dielectric top plate and raised central support include a plurality of holes to facilitate delivery of a cooling gas one or more cooling channels to a backside of the substrate when disposed on the embossed top surface of the dielectric top plate.