Electrostatic Chuck Epoxy Band Removal via Thermal Bond Breakdown
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Solution Overview
Problem
Semiconductor process chambers face high operational costs due to the frequent replacement of electrostatic chucks, which become contaminated with unwanted deposits from processing, leading to contamination of subsequent workpieces.
Innovation Solution
An electrostatic chuck refurbishing system and method that involves securing the chuck in a servicing fixture, applying a thermal source or coolant to break adhesive bonds, and using a pick tool to remove the epoxy band, allowing for the reuse of the electrostatic chuck.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrostatic chuck is periodically replaced to prevent contamination, then workpiece contamination is prevented, but operational cost increases
Solution Approach 1:
The patent applies the discarding and recovering principle by removing the contaminated epoxy band from the electrostatic chuck and recovering the chuck for reuse. The method involves heating the epoxy band to break adhesive bonds, then mechanically removing it while preserving the underlying chuck structure. This allows the expensive electrostatic chuck to be refurbished and reused multiple times, converting a disposable approach into a recoverable one, thereby reducing operational costs while maintaining workpiece contamination prevention.
2Reliability
If the electrostatic chuck is replaced with a new one, then contamination of subsequent workpieces is prevented, but device complexity and expense increase
Solution Approach 1:
The patent applies segmentation by dividing the electrostatic chuck into removable segments, specifically the epoxy band that becomes contaminated. Instead of replacing the entire electrostatic chuck, only the contaminated epoxy segment is removed and discarded. The remaining chuck structure is preserved and refurbished. This segmentation simplifies the refurbishment process, reducing device complexity while maintaining contamination prevention capabilities.
3Ease of operation
If thermal source is applied to breakdown adhesive bonds, then epoxy band removal is facilitated, but risk of damaging the electrostatic chuck increases
Solution Approach 1:
The patent applies parameter changes by carefully controlling the thermal parameters (temperature, heating time, heating distribution) when applying the thermal source to the epoxy band. The heating parameters are optimized to be sufficient to break down the adhesive bonds between the epoxy and the chuck, but not so extreme as to damage the electrostatic chuck structure. This controlled parameter change enables easy epoxy removal while preserving chuck integrity.
Solution Approach 2:
The patent uses a heated tip tool as an intermediary between the thermal source and the epoxy band. The tip tool distributes heat locally and controllably to the epoxy adhesive bonds without directly contacting or damaging the underlying electrostatic chuck structure. This intermediary approach facilitates effective heating for bond breakdown while protecting the chuck from thermal damage.
4Reliability
If the epoxy band is removed completely, then contamination source is eliminated, but risk of damaging the electrostatic chuck surface increases
Solution Approach 1:
The patent applies local quality by focusing the removal action specifically on the epoxy band while preserving the underlying electrostatic chuck surface. The heating is applied locally to the epoxy adhesive bonds, and the mechanical removal (using tools like picks or scrapers) is directed only at the softened epoxy material. This localized approach ensures complete elimination of the contamination source while maintaining the precision and integrity of the chuck surface for subsequent workpiece processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes the epoxy band without damaging the electrostatic chuck, reducing operational costs by allowing for the refurbishment and reuse of the component, thus minimizing contamination and extending the life of the chuck.
Implementation Method 1
applying a thermal source to the epoxy band to breakdown adhesive bonds securing the epoxy band to the electrostatic chuck
Implementation Method 2
applying a coolant to the epoxy band... cooling the epoxy band to a temperature of between about 40 degrees C. to about 100 degrees C. less than the temperature of the electrostatic chuck
Data Source
AI summary
A method of removing an epoxy band from an electrostatic chuck includes securing the electrostatic chuck in a servicing fixture, applying a thermal source to the epoxy band to breakdown a plurality of adhesive bonds securing the epoxy band to the electrostatic chuck, forming a hole in the epoxy band and pulling the epoxy band from the electrostatic chuck. A system for removing an epoxy band from an electrostatic chuck is also described.