Electrostatic Chuck Electrode Layout for Etch Uniformity

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Solution Overview

Problem

Existing electrostatic chucks in plasma processing apparatuses cause process non-uniformities due to the layout of electrodes, leading to side-to-side etch rate non-uniformity patterns.

Innovation Solution

A unique radial layout for the chucking electrodes with thermally isolated and electrically connected zones, along with a thermal control system and a sealing band, to improve process uniformity and temperature control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional electrode layout is used in electrostatic chuck, then device complexity is reduced, but process uniformity deteriorates due to side-to-side etch rate non-uniformity patterns

Engineering Contradiction:
Improveprocess uniformityVSAvoidelectrode layout complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The electrostatic chuck is divided into multiple independently controllable electrode zones (e.g., first, second, third, and fourth zones) arranged in a specific pattern. Each zone can be controlled separately to compensate for non-uniformities, thereby improving process uniformity without requiring complete redesign of the entire electrode system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different electrode zones are assigned different control parameters and potentials to address local non-uniformities in specific regions of the workpiece. This allows tailored control of etch rates in different zones, improving overall process uniformity while maintaining manageable device complexity through localized adjustments.

Inventive Principle:
Principle #3Local quality

2Temperature

If thermally isolated zones are implemented, then temperature control is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature controlVSAvoidthermal control structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The thermal control system is segmented into multiple thermally isolated zones that correspond to the electrode zones. Each thermal zone can be independently controlled to maintain uniform temperature distribution across the workpiece, preventing thermal non-uniformities that would otherwise degrade process quality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The thermal control zones are merged with the electrode zones in a coordinated manner, where each electrode zone has its corresponding thermal control zone. This integration allows simultaneous control of both electrical and thermal parameters in each region, improving overall process uniformity while utilizing shared structural elements.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If sealing band with sufficient width is used, then reliability is improved by preventing gas leakage, but device complexity increases

Engineering Contradiction:
Improvesealing effectivenessVSAvoidsealing band structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The sealing band is designed with specific width requirements (e.g., at least 0.05 inches) to ensure adequate sealing effectiveness in critical regions. This localized specification ensures reliability where needed while avoiding unnecessary complexity in non-critical areas, balancing sealing performance with device simplicity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves improved process uniformity by allowing independent control of each thermally isolated zone, enhancing temperature control in both radial and azimuthal directions, and ensuring the sealing band's durability to prevent gas leakage.

Implementation Method 1

an electrostatic chuck including a workpiece support surface configured to support a workpiece during processing of the workpiece

Methodology Applied
Scientific EffectElectrostatic attraction: Electrostatics

Implementation Method 2

a thermal control system

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250191958A1Electrostatic Chuck Assembly for Plasma Processing Apparatus
Publication Date: 2025.06.12 BEIJING E TOWN SEMICON TECH CO LTD
  • US20250191958A1 patent drawing
  • US20250191958A1 patent drawing
  • US20250191958A1 patent drawing

AI summary

An electrostatic chuck including a workpiece support surface, clamping layer, heating layer, thermal control system, and sealing band is disclosed. The sealing band surrounds an outer perimeter of the electrostatic chuck including at least a portion of the workpiece surface. The sealing band has a width greater than about 3 millimeters (mm) up to about 10 mm. Plasma processing apparatuses and systems incorporating the electrostatic chuck are also provided.