Electrostatic Chuck Thermal Expansion Joint
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Solution Overview
Problem
Current semiconductor processing systems face challenges in controlling substrate temperature during high-temperature reduced-pressure processing, as existing technologies struggle to efficiently manage thermal expansion and maintain uniform temperature across the substrate.
Innovation Solution
An electrostatic chuck with a chuck body, heat sink body, and expansion joint is designed to clamp and heat substrates, featuring an electrostatic clamp electrode and optional heating elements, along with a heat sink body for efficient heat removal and a table assembly that accommodates differential thermal expansion, ensuring precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a substrate holder is used for high-temperature processing, then the substrate temperature can be elevated to required levels, but differential thermal expansion between components causes sealing and structural issues
Solution Approach 1:
The patent employs flexible bellows structures (expansion joints) made of thin-walled materials that can accommodate differential thermal expansion between the substrate holder and chamber wall. These flexible elements maintain sealing while allowing relative movement, resolving the contradiction between high-temperature operation and structural stability.
Solution Approach 2:
The patent explicitly addresses thermal expansion by designing expansion joints that accommodate the differential thermal expansion between components. The bellows structure is specifically engineered to expand and contract in response to temperature changes, maintaining structural integrity and sealing at elevated temperatures.
2Manufacturing precision
If heating elements are added to control substrate temperature, then temperature uniformity can be improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into integrated components. The substrate holder serves as both the mechanical support structure and the heating element carrier, with heating elements embedded within or attached to the holder. This merging approach improves temperature uniformity while minimizing additional device complexity by utilizing existing structural components.
Solution Approach 2:
The substrate holder is designed as a multi-functional component that provides mechanical support, thermal management, and electrostatic clamping functions. By making the holder universal and multi-functional, the patent avoids adding separate dedicated components for each function, thereby improving temperature control without proportionally increasing device complexity.
3Reliability
If an expansion joint is added to accommodate thermal expansion, then sealing capability is maintained, but device complexity increases
Solution Approach 1:
The expansion joint is implemented as a flexible bellows structure that provides sealing while accommodating thermal expansion. This flexible membrane approach maintains reliability by preserving the seal between the substrate holder and chamber wall, while adding minimal complexity compared to rigid mechanical sealing solutions.
Solution Approach 2:
The expansion joint acts as an intermediary element between the substrate holder and chamber wall, mediating the thermal expansion differences. This intermediate flexible connection maintains sealing capability while absorbing dimensional changes, resolving the contradiction between reliability and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective temperature control of substrates up to 450 degrees C with uniformity, addressing the challenges of thermal management and expansion, thereby enhancing processing accuracy and efficiency in semiconductor manufacturing.
Implementation Method 1
an electrostatic clamp electrode... configured to clamp a substrate on an outer surface of the chuck body
Implementation Method 2
an optional heating element... configured to elevate a temperature of the substrate
Implementation Method 3
a heat sink body having a heat transfer surface spaced in close relationship with an inner surface of the chuck body, wherein the heat sink body is configured to remove heat from the chuck body
Implementation Method 4
an expansion joint disposed between the chuck body and the table assembly, and configured to sealably join the chuck body to the table assembly while accommodating for differential thermal expansion
Data Source
AI summary
An electrostatic chuck configured for high temperature reduced-pressure processing is described. The electrostatic chuck comprises a chuck body having an electrostatic clamp electrode and an optional heating element, and a heat sink body having a heat transfer surface spaced in close relationship with an inner surface of the chuck body, wherein the heat sink body is configured to remove heat from the chuck body due to the close proximity of the inner surface and the heat transfer surface. The electrostatic chuck further comprises a table assembly configured to support the chuck body and the heat sink body, and an expansion joint disposed between the chuck body and the table assembly, and configured to sealably join the chuck body to the table assembly while accommodating for differential thermal expansion of the chuck body and the table assembly.