Electrostatic Chuck Fastening for Stage Distortion Control
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Solution Overview
Problem
In plasma processing apparatuses, the susceptor warps due to pressure differences and linear expansion stress, causing substrate warpage, as existing fastening methods do not effectively manage these issues.
Innovation Solution
The electrostatic chuck and chuck placement plate are fastened with first fasteners from the lower side, improving stage rigidity, and the stage is secured to a support with second fasteners from the upper side, allowing for easy attachment and detachment while minimizing distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the susceptor is fastened to the support base by bolts at the peripheral edge, then the susceptor can be securely attached, but the susceptor warps due to pressure differences and linear expansion stress causing substrate warpage
Solution Approach 1:
The fastening system is divided into two distinct sets: first fasteners that fasten the electrostatic chuck to the chuck placement plate, and second fasteners that fasten the stage to the support. This segmentation allows independent optimization of each fastening function, with the first fasteners managing local attachment strength and the second fasteners managing overall stage stability while minimizing distortion.
Solution Approach 2:
The chuck placement plate serves as an intermediary component between the electrostatic chuck and the stage structure. This intermediary element distributes and manages the fastening forces, reducing direct stress transmission to the susceptor that would cause warping, while still maintaining secure attachment.
2Manufacturing precision
If the stage structure is rigidly fastened to prevent distortion, then temperature control uniformity improves, but attachment and detachment becomes difficult
Solution Approach 1:
The fastening system transitions from a static, permanently fixed configuration to a dynamic, selectively engageable system. The stage can be easily attached and detached by engaging or disengaging the fasteners, while maintaining rigid structural integrity when fastened, thus achieving both operational flexibility and thermal control precision.
Solution Approach 2:
The dual fastener system segments the attachment functions: first fasteners for the electrostatic chuck assembly and second fasteners for the stage to support connection. This segmentation enables independent control of each attachment interface, allowing the stage to be securely fastened for processing while maintaining ease of attachment and detachment operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses stage distortion and substrate warpage, enhancing temperature control uniformity and maintaining precision in semiconductor processing.
Implementation Method 1
an electrostatic chuck having a substrate placement surface on which a substrate is placed
Data Source
AI summary
Disclosed is a stage including: an electrostatic chuck having a substrate placement surface on which a substrate is placed; and an electrostatic chuck placement plate on which the electrostatic chuck is placed. The electrostatic chuck and the electrostatic chuck placement plate are fastened by a plurality of first fasteners from a side of the electrostatic chuck placement plate, and the stage is fastened to a support provided on an opposite side of the electrostatic chuck of the electrostatic chuck placement plate by a plurality of second fasteners on a radially outer side of the placement surface.