Electrostatic Chuck Joining Layer With Fillers for Lower Thermal Resistance

The patent applies local quality by creating a multi-layer structure where the first resin layer contains fillers for heat dissipation while the second resin layer remains filler-free for adhesion. This spatial differentiation of material properties allows each layer to optimize its specific function: the filler-containing first layer handles thermal management at the interface with the retention member, while the filler-free second layer ensures bonding quality at the interface with the base member.

The patent uses composite materials by combining resin matrices with filler particles (such as metal oxides or ceramics) in the first resin layer to create a material that simultaneously provides adhesion and enhanced thermal conductivity. The composite structure allows the joining layer to achieve both mechanical reliability and improved heat transfer properties that neither component could provide alone.

The patent segments the joining layer into two distinct resin layers with different compositions. The first resin layer contains fillers optimized for thermal conductivity, while the second resin layer is filler-free to maximize adhesion and flexibility. This segmentation allows each layer to independently optimize its properties without compromising the other, solving the contradiction between heat transfer and mechanical performance.

The patent changes the physical and chemical parameters of the resin layers by controlling filler content, particle size, distribution, and resin matrix composition. By adjusting these parameters differently in the first and second layers, the patent achieves optimal balance between thermal conductivity and adhesion/flexibility, transforming a single-material compromise into a multi-material optimization.