Electrostatic Chuck Gas Flow Path for Uniform Wafer Temperature
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Solution Overview
Problem
In existing electrostatic chuck members, a steep temperature gradient is generated at the boundary between regions with and without gas flow paths, leading to non-uniform temperature distribution of wafers.
Innovation Solution
The electrostatic chuck member features a dielectric substrate with gas flow paths extending along the placement surface, having inclined side surfaces to gradually reduce the cooling effect from the center to the periphery, and a joining layer with higher thermal conductivity than the supporting plates, ensuring uniform temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a gas flow path is provided in the electrostatic chuck member for cooling, then cooling efficiency is improved, but a steep temperature gradient is generated at the boundary between regions with and without gas flow paths
Solution Approach 1:
The gas flow path is designed with an inclined side surface portion that gradually reduces the cooling effect from the center to the periphery of the electrostatic chuck member. This creates a local quality gradient where the cooling intensity varies continuously across the structure, preventing abrupt temperature changes at boundaries while maintaining effective cooling in regions where it is most needed.
2Ease of manufacture
If the gas flow path has vertical side surfaces for simple manufacturing, then ease of manufacture is improved, but steep temperature gradients occur at flow path boundaries
Solution Approach 1:
The gas flow path incorporates an inclined side surface portion rather than vertical sides, creating an asymmetric geometry that deliberately controls the cooling distribution. This asymmetric design allows the cooling effect to taper gradually toward the periphery, eliminating the abrupt temperature gradients that would result from symmetric vertical side surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a uniform temperature distribution of wafers by gradually reducing the cooling effect across the chuck member, minimizing steep temperature gradients and enhancing cooling efficiency.
Implementation Method 1
the electrostatic chuck member can be cooled by heat transfer gas
Implementation Method 2
a steep temperature gradient is generated at a boundary between a region in which the gas flow path is provided and a region in which the gas flow path is not provided
Data Source
AI summary
Provided is an electrostatic chuck member including: a dielectric substrate having a placement surface on which a sample is mounted, wherein a direction orthogonal to the placement surface is a thickness direction thereof; and an adsorption electrode which is embedded in the dielectric substrate, in which a gas flow path which extends along a planar direction of the placement surface, is provided in the dielectric substrate, the gas flow path has an inner surface which includes a bottom surface portion that faces the same direction as the placement surface, a top surface portion that faces the bottom surface portion, and a pair of side surface portions that connect the bottom surface portion and the top surface portion, wherein at least one of the side surface portions is inclined with respect to the thickness direction.