Electrostatic Chuck Gas Hole Bonding to Prevent Abnormal Discharge
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Solution Overview
Problem
The through-hole in electrostatic chuck devices for gas supply can cause abnormal discharge, leading to wafer damage, and existing countermeasures like inserting a porous body suffer from clogging and poor maintainability.
Innovation Solution
An electrostatic chuck device with a porous body inserted into the through-hole, bonded using a thin adhesive layer, which enhances maintainability by allowing easy replacement and preventing adhesive erosion from plasma.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a porous body is inserted into the through-hole to prevent abnormal discharge, then abnormal discharge is suppressed, but clogging occurs due to particles generated during wafer processing, leading to poor maintainability
Solution Approach 1:
The disturbing element (porous body) is extracted from the through-hole, eliminating the clogging problem while maintaining abnormal discharge prevention through the adhesive layer configuration
Solution Approach 2:
The adhesive layer serves as an intermediary substance that fills the through-hole and prevents abnormal discharge, replacing the porous body while avoiding particle clogging issues
2Strength
If a thick adhesive layer is used to bond the porous body, then bonding strength is improved, but adhesive erosion from plasma occurs more easily
Solution Approach 1:
The adhesive layer thickness is optimized to a specific range (0.01mm to 0.15mm) that balances bonding strength and plasma resistance, preventing both weak bonding and adhesive erosion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an electrostatic chuck device with improved maintainability by preventing clogging and adhesive erosion, ensuring reliable operation and easy replacement of the porous body.
Implementation Method 1
a porous body that allows passage of the gas is inserted into the first through-hole
Implementation Method 2
a first adhesive layer that bonds an inner peripheral surface of the first through-hole and an outer peripheral surface of the porous body to each other is provided between the inner peripheral surface and the outer peripheral surface
Implementation Method 3
an electrostatic force is generated between the plate-shaped sample and an internal electrode to adsorb and fix the plate-shaped sample
Data Source
AI summary
Provided is an electrostatic chuck device including: an electrostatic chuck plate including a dielectric substrate that includes a placement surface on which a sample is mounted and an adsorption electrode that is positioned inside the dielectric substrate; and a base that supports the electrostatic chuck plate from a side opposite to the placement surface, in which in the electrostatic chuck plate, a first through-hole through which gas is supplied to the placement surface is provided, a porous body that allows passage of the gas is inserted into the first through-hole, a first adhesive layer that bonds an inner peripheral surface of the first through-hole and an outer peripheral surface of the porous body to each other is provided between the inner peripheral surface and the outer peripheral surface, and a thickness dimension of the first adhesive layer is 0 mm or more and 0.15 mm or less, at least in a region of 0.1 mm from the placement surface.