Electrostatic Chuck Gas Hole Structure to Prevent Plasma Discharge
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Solution Overview
Problem
Existing plasma processing apparatuses experience abnormal discharges in the heat transfer gas flow paths due to dimensional and installation tolerances of embedded members or sleeves, leading to unexpected errors.
Innovation Solution
The apparatus incorporates a conductive member around heat transfer gas supply holes with diameters of 0.2 mm or less, forming an electric field-free space to prevent or reduce abnormal discharges, and uses integrated conductive ceramic members to ensure precise gap dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an embedded member or sleeve is provided in the heat transfer gas flow path, then the heat transfer gas can be supplied through the flow path, but abnormal discharge may occur due to dimensional and installation tolerances
Solution Approach 1:
The conductive member is electrically connected to the electrostatic chuck to maintain the same electric potential throughout the heat transfer gas flow path. This eliminates potential differences that would otherwise cause abnormal discharge, as the entire flow path structure (electrostatic chuck, conductive member, embedded member, and sleeve) is held at equipotential.
Solution Approach 2:
The conductive member acts as an intermediary component that bridges the electrostatic chuck and the embedded member/sleeve assembly. It provides a conductive path that equalizes electric potential between these components, preventing abnormal discharge while allowing the heat transfer gas flow path to function.
2Object-affected harmful factors
If the heat transfer gas supply hole diameter is reduced to 0.2 mm or less, then abnormal discharge is prevented, but manufacturing precision requirements increase
Solution Approach 1:
The conductive member is designed to be in direct contact with the electrostatic chuck and the embedded member, allowing it to automatically equalize electric potential through physical contact. This self-adjusting mechanism eliminates abnormal discharge without requiring high-precision manufacturing of the heat transfer gas supply hole, as the conductive path forms naturally through the contact interfaces.
3Reliability
If a sleeve is provided inside the second through-hole, then the heat transfer gas flow path is formed, but dimensional tolerances cause abnormal discharge
Solution Approach 1:
The conductive member serves multiple functions simultaneously: it provides electrical conductivity to equalize potential, structurally supports the embedded member and sleeve assembly, and helps define the heat transfer gas flow path geometry. This multi-functionality allows it to accommodate dimensional tolerances while preventing abnormal discharge.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents or reduces abnormal discharges, ensuring stable plasma processing by maintaining uniform potential and reducing the risk of errors in the heat transfer gas flow paths.
Implementation Method 1
the at least one conductive member is disposed around at least a portion of the heat transfer gas supply hole
Implementation Method 2
an electrostatic chuck disposed on an upper surface of the base and having a support surface that supports at least one of a substrate and a ring assembly
Data Source
AI summary
A plasma processing apparatus includes: a plasma processing chamber, a base disposed in the plasma processing chamber, and an electrostatic chuck disposed on an upper surface of the base and having a support surface that supports at least one of a substrate and a ring assembly. The electrostatic chuck includes at least one conductive member, the electrostatic chuck is formed with at least one heat transfer gas supply hole having a diameter of 0.2 mm or less and penetrating from the support surface to a rear surface opposite to the support surface, and the at least one conductive member is disposed around at least a portion of the heat transfer gas supply hole.