Electrostatic Chuck Groove Design for Gas Pressure Control
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Solution Overview
Problem
Existing electrostatic chucks used in processing apparatuses face challenges in controlling gas pressure across regions without sealing rings, leading to particle deposition issues and reduced gas pressure controllability, which can result in temperature distribution discrepancies and defects during wafer patterning processes.
Innovation Solution
The electrostatic chuck design eliminates sealing rings by using strategically arranged grooves and gas introduction holes to create an enclosed space between the object and the ceramic dielectric substrate, with shorter groove end-to-end distances and additional grooves to enhance gas pressure control, allowing effective pressure management across regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If sealing rings are provided between regions to control gas pressure, then gas pressure controllability is improved, but particle deposition at sealing ring portions increases
Solution Approach 1:
The invention removes sealing rings from the system entirely. Instead of using sealing rings to control gas pressure in each region, the patent uses a different approach where gas introduction holes and grooves create enclosed spaces without requiring sealing rings, thereby eliminating particle deposition at sealing ring portions while maintaining gas pressure controllability
Solution Approach 2:
The invention introduces grooves as intermediary structures between gas introduction holes and enclosed spaces. These grooves facilitate gas distribution and pressure control without requiring sealing rings, serving as a mediator that achieves both gas pressure controllability and particle-free operation
2Stress or pressure
If sealing rings are provided to partition regions airtightly, then gas pressure control in each region is improved, but particle collection at sealing ring portions occurs
Solution Approach 1:
The invention extracts and removes sealing rings from the system. Gas pressure control is achieved through alternative means using gas introduction holes and grooves that create enclosed spaces without sealing rings, eliminating the source of particle collection and defects
Solution Approach 2:
The invention replaces the mechanical sealing ring system with a groove-based enclosed space system. Instead of using mechanical sealing rings to partition regions, the patent uses grooves配合gas introduction holes to create enclosed spaces, substituting a mechanical sealing system with a groove-based system that avoids particle collection
3Stress or pressure
If a slight gap is provided between object and sealing ring top portion to control gas pressure, then gas pressure control is achieved, but particle deposition problem remains unsolved
Solution Approach 1:
The invention removes sealing rings entirely from the system. Instead of providing a slight gap between the object and sealing ring top portion, the patent uses gas introduction holes and grooves to create enclosed spaces and control gas pressure without sealing rings, thereby eliminating particle deposition at sealing ring portions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses particle deposition at sealing ring locations, maintains target gas pressures in each region, and improves temperature control responsiveness, reducing in-plane temperature distribution and enhancing processing precision.
Implementation Method 1
An electrostatic force is generated when electrical power is applied to the electrode. The electrostatic chuck attracts and holds an object such as a silicon wafer or the like by the generated electrostatic force.
Implementation Method 2
heat dissipation of the substrate is realized by causing the gas to flow between the ceramic dielectric substrate and the substrate and by causing the gas to contact the substrate
Data Source
AI summary
An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole is connected to at least one of multiple first grooves. At least one second groove are provided in the first region. The multiple first grooves have substantially circular planar configurations and are provided concentrically. The second groove is connected to at least two of the first grooves. When projected onto a plane perpendicular to a first direction from the base plate toward the ceramic dielectric substrate, at least a portion of the first gas introduction hole overlaps at least one of the first groove or the second groove at a portion where the first groove and the second groove are connected.