Electrostatic Chuck Heat Transfer Layer for High-Temperature Maintenance

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Solution Overview

Problem

Existing electrostatic chucks face issues with heat transfer efficiency deterioration and maintenance difficulties due to material degradation at high temperatures, and separation challenges between the chuck main body and base.

Innovation Solution

Incorporation of a heat transfer layer using a heat transfer fluid between the chuck main body and base, with seals and a design allowing for easy separation and maintenance, enabling stable high-temperature operation and efficient heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a bonding layer made of silicone is used to couple the chuck main body and chuck base, then the electrostatic chuck can be assembled and function, but the bonding layer is damaged at temperatures of about 150°C or higher, causing heat transfer efficiency deterioration and inability to operate under high-temperature conditions

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidoperating temperature
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent divides the coupling structure into separable components: the chuck main body can be detached from the chuck base. This segmentation allows the heat transfer layer to be optimized independently without being constrained by bonding material limitations, enabling high-temperature operation while maintaining reliable heat transfer.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a heat transfer layer as an intermediary component between the chuck main body and chuck base. This layer uses heat transfer fluid (liquid or gas) instead of silicone bonding material, mediating the thermal connection while allowing the system to operate at temperatures above 150°C without material degradation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of repair

If the chuck main body is coupled to the chuck base using a bonding layer, then the structure is assembled, but it becomes difficult to separate the chuck main body from the chuck base, making maintenance difficult

Engineering Contradiction:
Improvemaintenance easeVSAvoidstructure complexity
Core Design Contradiction:
Ease of repairVSDevice complexity

Solution Approach 1:

The patent divides the electrostatic chuck into separable segments: the chuck main body and chuck base can be easily detached from each other. This segmentation enables straightforward maintenance and repair operations without requiring complex disassembly procedures, while the overall structure remains relatively simple through standardized coupling interfaces.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Stable heat transfer is maintained at high temperatures, facilitating easy maintenance by allowing the chuck main body to be separated from the base, enhancing the reliability and convenience of substrate processing.

Implementation Method 1

a heat transfer layer disposed between the chuck main body and the chuck base and configured to use a heat transfer fluid

Methodology Applied
Scientific EffectHeat transfer fluid: Convection

Implementation Method 2

a chuck main body disposed at an upper side of the electrostatic chuck and configured to attach a substrate with an electrostatic force

Methodology Applied
Scientific EffectElectrostatic force: Electrostatics

Data Source

PatentUS12354852B2Electrostatic chuck, substrate processing apparatus, and substrate processing method
Publication Date: 2025.07.08 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US12354852B2 patent drawing
  • US12354852B2 patent drawing
  • US12354852B2 patent drawing

AI summary

The present disclosure provides an electrostatic chuck, in which a heat transfer layer using a heat transfer fluid is disposed between a chuck main body disposed at an upper side of the electrostatic chuck and a chuck base disposed at a lower side of the electrostatic chuck, and the chuck main body is simply placed on the chuck base so as to be physically in contact with the heat transfer layer, such that heat may be stably transferred without damage even in a condition in which the heat transfer layer is at a high temperature, and the chuck main body may be easily separated from the chuck base for maintenance.