Electrostatic Chuck Heater Stack for Faster Cooling
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Solution Overview
Problem
Existing electrostatic chuck heaters face challenges in quickly cooling the electrostatic chuck due to high heat resistance, especially when external heat inputs like plasma heat are applied to the wafer.
Innovation Solution
The electrostatic chuck heater incorporates a heater layer with multiple stages of metal layers, including resistance heating element layers, and a ceramic insulating layer with a thickness of 2 μm or more and 50 μm or less, which reduces heat resistance and allows for quicker cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a sheet heater with resin is used between the electrostatic chuck and cooling member, then the overall thickness can be reduced, but the heat resistance increases making it difficult to quickly cool the electrostatic chuck
Solution Approach 1:
The patent changes the material parameter from resin to ceramic for the insulating layer, and optimizes the thickness parameter to 2-50 μm. Ceramic material has higher thermal conductivity than resin, which reduces heat resistance while maintaining electrical insulation. The controlled thickness range ensures both low heat resistance and adequate dielectric strength.
Solution Approach 2:
The patent creates a composite structure combining ceramic insulating layers with metal heating element layers. This composite material approach allows the insulating layer to provide both electrical insulation and thermal conduction properties, resolving the contradiction between insulation requirements and heat dissipation needs.
2Reliability
If the ceramic insulating layer thickness is increased to satisfy dielectric strength, then electrical insulation is improved, but the heat resistance increases and cooling speed decreases
Solution Approach 1:
The patent optimizes the thickness parameter of the ceramic insulating layer to a specific range (2-50 μm). This parameter optimization achieves the right balance: thick enough to provide adequate dielectric strength for electrical insulation, but thin enough to maintain low heat resistance for fast cooling. The ceramic material selection also contributes to higher thermal conductivity compared to alternative materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the ability to cope with external heat inputs by reducing the heat resistance and overall thickness of the heater layer, enabling faster cooling of the electrostatic chuck.
Implementation Method 1
a plurality of metal layers 42 embedded therein in multiple stages, the metal layers including resistance heating element layers 44a and 44b
Implementation Method 2
ceramic has a higher thermal conductivity than resin. As a result, a heat resistance of the heater layer disposed between the electrostatic chuck and the cooling member is reduced
Implementation Method 3
a cooling member 30 cooling the electrostatic chuck 20
Data Source
AI summary
An electrostatic chuck heater includes an electrostatic chuck including an electrostatic electrode embedded in a ceramic sintered body, a cooling member cooling the electrostatic chuck, and a heater layer disposed between the electrostatic chuck and the cooling member and including a plurality of metal layers embedded therein in multiple stages, the metal layers including resistance heating element layers. The heater layer includes a ceramic insulating layer with a thickness of 2 μm or more and 50 μm or less between the metal layers.