Electrostatic Chuck Heater Plate Segmentation for Temperature Uniformity
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Solution Overview
Problem
Existing electrostatic chucks face challenges in maintaining uniform temperature distribution on semiconductor wafers due to heater patterns, leading to temperature unevenness and decreased patterning precision in semiconductor processing.
Innovation Solution
The electrostatic chuck design incorporates a ceramic dielectric substrate with a heater plate featuring multiple independent heater regions and a bypass layer, where the first heater element with higher electrical resistance and more bends suppresses temperature unevenness, and the bypass layer enhances thermal diffusion and power supply flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a heater with a planar pattern configuration is provided in the electrostatic chuck, then the output can be realized as necessary, but temperature unevenness occurs in the electrostatic chuck and temperature uniformity decreases
Solution Approach 1:
The heater is divided into multiple independent heating regions (first heating region, second heating region, third heating region) with different heating outputs. Each region can be controlled independently to compensate for temperature variations across the wafer surface, thereby maintaining both high power output capability and temperature uniformity.
Solution Approach 2:
Different regions of the heater are assigned different heating characteristics - the first heating region has high heating output for areas requiring more heat, while the second and third heating regions have lower heating outputs for areas requiring less heat. This local differentiation of heating quality eliminates temperature unevenness while preserving overall heater effectiveness.
2Temperature
If two types of heaters are provided to improve temperature uniformity, then temperature distribution improves, but the thickness of the entire heater increases and response time decreases
Solution Approach 1:
The heater is segmented into multiple independent heating regions that can be controlled separately. This allows selective activation of only the heating regions needed for current process conditions, reducing the effective thermal mass that must be heated and thereby improving response time while maintaining temperature uniformity through coordinated control of different regions.
Solution Approach 2:
The heater employs dynamic control of multiple heating regions, where the heating output of each region can be adjusted in real-time based on process requirements. This dynamic adaptability allows the system to respond quickly to temperature changes by activating only necessary heating zones, improving both response time and temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves improved temperature uniformity and control on the wafer surface, allowing for finer temperature adjustments and increased patterning precision, thereby supporting the downsizing and faster processing of semiconductor chips.
Implementation Method 1
the first heater element generates heat due to a current flowing; the second heater element generates heat due to a current flowing
Implementation Method 2
The electrostatic chuck applies electrical power for electrostatic attraction to a built-in electrode and attracts and holds a substrate such as a silicon wafer, etc., by an electrostatic force
Data Source
AI summary
According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, an electrode layer, a base plate, and a heater plate. The ceramic dielectric substrate has a first major surface where a processing object is placed. The electrode layer is provided in the ceramic dielectric substrate. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the base plate and the first major surface. The heater plate includes a first heater element and a second heater element. The first heater element emits heat due to a current flowing. The second heater element emits heat due to a current flowing. When viewed along a direction perpendicular to the first major surface, bends of the first heater element is more than bends of the second heater element, and the first heater element includes a portion positioned at a gap of the second heater element.