Electrostatic Chuck Radial Heater Zones for Temperature Uniformity
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Solution Overview
Problem
Substrate processing in chambers often results in non-uniform processing rates and temperature variations across the substrate surface due to uneven gas distribution, plasma species distribution, and non-uniform heat loads, leading to undesirable processing outcomes for semiconductors and displays.
Innovation Solution
An electrostatic chuck with a ceramic puck featuring a substrate receiving surface with mesas, embedded electrodes, and radially spaced heater coils, along with heat transfer gas conduits, is used to maintain uniform processing by controlling temperature and gas distribution across the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single heating zone is used in the electrostatic chuck, then the structure is simple, but the temperature distribution across the substrate surface becomes non-uniform
Solution Approach 1:
The heating system is divided into multiple independent heating zones (first heating zone, second heating zone, third heating zone) with separate heater coils, allowing independent temperature control of different regions to achieve uniform temperature distribution across the substrate surface
Solution Approach 2:
Different regions of the electrostatic chuck are assigned different heating characteristics through localized heater coils in different zones, enabling tailored temperature control for central and peripheral regions to compensate for non-uniform heat loads and achieve overall temperature uniformity
2Manufacturing precision
If uniform gas distribution is provided across the substrate, then the processing becomes uniform, but the device complexity increases due to multiple gas conduits and ports
Solution Approach 1:
The gas distribution system is segmented into multiple independent gas conduits (first gas conduit, second gas conduit) with separate ports, allowing independent control of gas flow to different regions of the substrate to achieve uniform gas distribution and processing uniformity
Solution Approach 2:
Different regions of the substrate receive gas through dedicated conduits and ports positioned to deliver uniform gas distribution across central and peripheral regions, enabling localized gas flow control to compensate for non-uniform processing conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures more uniform processing rates and characteristics across the substrate surface by independently controlling temperatures and gas distribution, counteracting variability in gas species and heat loads, thereby enhancing the fabrication of electronic devices.
Implementation Method 1
An electrostatic chuck for receiving a substrate in a substrate processing chamber comprises a ceramic puck having a substrate receiving surface having a plurality of spaced apart mesas, an opposing backside surface, and central and peripheral portions. A plurality of heat transfer gas conduits traverse the ceramic puck and terminate in ports on the substrate receiving surface to provide heat transfer gas to the substrate receiving surface. An electrode is embedded in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface.
Implementation Method 2
A plurality of heater coils are also embedded in the ceramic puck, the heaters being radially spaced apart and concentric to one another.
Implementation Method 3
A plurality of heat transfer gas conduits traverse the ceramic puck and terminate in ports on the substrate receiving surface to provide heat transfer gas to the substrate receiving surface.
Data Source
AI summary
An electrostatic chuck for receiving a substrate in a substrate processing chamber comprises a ceramic puck having a substrate receiving surface having a plurality of spaced apart mesas, an opposing backside surface, and central and peripheral portions. A plurality of heat transfer gas conduits traverse the ceramic puck and terminate in ports on the substrate receiving surface to provide heat transfer gas to the substrate receiving surface. An electrode is embedded in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface. A plurality of heater coils are also embedded in the ceramic puck, the heaters being radially spaced apart and concentric to one another.


