Electrostatic Chuck Assembly for High-Temperature Substrate Support
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electrostatic chucks used in semiconductor manufacturing are unsuitable for high temperature applications due to material degradation from thermal cycling, arcing, and the use of organic bonding materials, leading to inefficient and laborious plate replacement processes.
Innovation Solution
A substrate support assembly with a chuck electrostatically secured to a cooling plate using clamp electrodes, where both the chuck and cooling plate are made of dielectric materials with similar thermal expansion coefficients, and a protective coating on the cooling plate reduces arcing, allowing for high temperature and low temperature applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional electrostatic chucks are used in high temperature applications, then substrate processing can be performed, but material degradation occurs due to thermal cycling and arcing
Solution Approach 1:
The chuck is constructed from alumina ceramic material which provides both high temperature resistance and dielectric properties. The cooling plate uses aluminum with diamond-like carbon coating, creating a composite structure that withstands thermal cycling while maintaining electrical insulation. This composite approach resolves the contradiction between high temperature capability and material reliability.
Solution Approach 2:
The patent changes the material parameters by selecting alumina ceramic for the chuck instead of conventional materials, and applies diamond-like carbon coating to the cooling plate. These parameter changes enable the system to operate at high temperatures without degradation from thermal cycling or arcing, resolving the reliability issue.
2Ease of manufacture
If organic bonding materials are used to attach chuck to cooling plate, then assembly can be formed, but the bonding materials degrade at high temperatures
Solution Approach 1:
The patent removes organic bonding materials from the assembly by using mechanical attachment methods instead. The chuck is attached to the cooling plate through protrusions fitting into recesses, eliminating the organic bonding layer that would degrade at high temperatures while maintaining easy assembly through the mechanical interface.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (organic adhesives) with a mechanical attachment system using protrusions and recesses. This substitution allows the assembly to withstand high temperatures without bonding material degradation while maintaining ease of manufacture and assembly.
3Strength
If clamp electrodes are used to electrostatically secure the chuck to the cooling plate, then secure attachment is achieved, but arcing can occur
Solution Approach 1:
The patent introduces an intermediary diamond-like carbon coating layer between the aluminum cooling plate and the alumina chuck. This intermediary layer prevents direct electrical contact that would cause arcing, while still allowing the clamp electrodes to maintain electrostatic attachment strength.
Solution Approach 2:
The diamond-like carbon coating creates an electrically inert environment between the conductive cooling plate and the dielectric chuck, preventing electrical breakdown and arcing. This inert barrier allows strong electrostatic attachment through the clamp electrodes without the harmful effects of arcing.
4Loss of energy
If direct contact between chuck and cooling plate is used, then heat transfer is efficient, but material degradation occurs from thermal cycling
Solution Approach 1:
The patent segments the contact interface between chuck and cooling plate by using multiple protrusions distributed across the surface rather than a single continuous contact area. This segmentation reduces thermal stress concentration at any one point, minimizing material degradation from thermal cycling while maintaining overall heat transfer efficiency through the distributed contact points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly provides consistent and accurate substrate processing with reduced damage and longer service life by minimizing material degradation and enhancing heat transfer through mesas and labyrinth seals, thus improving manufacturing efficiency.
Implementation Method 1
The chuck includes one or more clamp electrodes to electrostatically secure the chuck to the cooling plate
Data Source
AI summary
A substrate support assembly includes a cooling plate. The substrate support assembly further includes a chuck disposed on the cooling plate. The chuck includes one or more clamp electrodes to electrostatically secure the chuck to the cooling plate. The substrate support assembly further includes multiple mesas formed on a bottom surface of the chuck or formed on a top surface of the cooling plate to separate the chuck from the cooling plate.