Electrostatic Chuck Electrode Layout for Through-Hole Breakdown Control
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Solution Overview
Problem
Conventional electrostatic chucks in semiconductor manufacturing equipment face the risk of dielectric breakdown through holes due to strong electric fields, particularly when an RF electrode and an attracting electrode are embedded within a dielectric substrate, leading to potential electrical failures during substrate processing.
Innovation Solution
The electrostatic chuck design incorporates a dielectric substrate with a through hole for gas supply, featuring a larger radius opening in the RF electrode compared to the attracting electrode, which reduces the electric field component directed through the hole, thereby minimizing the risk of dielectric breakdown. The radius difference between the two openings is optimized to be between 1.6 mm and 5.4 mm, ensuring effective electric field distribution and preventing breakdowns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a through hole is formed in the dielectric substrate for gas supply, then gas can be supplied between the dielectric substrate and substrate, but a strong electric field is created in the through hole causing dielectric breakdown
Solution Approach 1:
The patent applies local quality by creating openings in the electrodes at different locations and with different sizes. The first opening in the attracting electrode and the second opening in the RF electrode are positioned to overlap with the through hole, but the second opening has a larger radius than the first opening. This local structural modification changes the electric field distribution specifically in the region of the through hole, reducing the electric field component directed through the hole while maintaining gas supply capability.
2Reliability
If the radius of the second opening in the RF electrode is increased to reduce electric field through the through hole, then dielectric breakdown is suppressed, but the electric field may affect other portions through the second opening
Solution Approach 1:
The patent applies parameter changes by optimizing the radius of the second opening in the RF electrode. The radius is set to be larger than the first opening to reduce the electric field component through the through hole, but not excessively large to avoid affecting other portions. This precise parameter control balances two opposing requirements: suppressing dielectric breakdown in the through hole while preventing electric field exposure to other sensitive areas of the dielectric substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the likelihood of dielectric breakdown through the through hole, ensuring reliable operation during substrate processing by maintaining a safe distance between the electric field edges and the hole, particularly in gas-supplying regions where breakdowns are more likely to occur.
Implementation Method 1
When voltage is applied to the attracting electrode, an electrostatic force is created and a substrate placed on the dielectric substrate is attracted and held
Implementation Method 2
a through hole which perpendicularly penetrates a placement surface is often formed in a dielectric substrate. Such a through hole is formed for the purpose of supplying an inert gas such as helium between the dielectric substrate and a substrate
Implementation Method 3
in the through hole, for example, a strong electric field is created from an edge of the opening of the attracting electrode toward an edge of the opening of the RF electrode. Since a direction of such an electric field is the same as a direction in which the through hole extends, there is a possibility that a dielectric breakdown may occur
Data Source
AI summary
An electrostatic chuck includes: a dielectric substrate in which a through hole is formed; an RF electrode which is embedded inside the dielectric substrate; and an attracting electrode which is embedded inside the dielectric substrate at a position that is closer to a placement surface than the RF electrode. When viewed from a direction perpendicular to the placement surface, a circular first opening which is concentric with the through hole and which includes the through hole is formed in the attracting electrode and a circular second opening which is concentric with the through hole and which includes the through hole is formed in the RF electrode. A radius of the second opening is larger than a radius of the first opening.