Electrostatic Chuck Insulating Film for Johnsen-Rahbek Force

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Solution Overview

Problem

Existing electrostatic chucks fail to maintain sufficient Johnsen-Rahbek force when a conductive film is deposited on both the wafer and the ceramic plate, as they often result in the same electric potential, leading to a decrease in attracting force.

Innovation Solution

An electrostatic chuck with an embedded electrostatic electrode in a disk-like ceramic plate, featuring an insulating film with higher electric resistance than the ceramic plate in an annular region around the electrode, ensuring the wafer and ceramic plate do not share the same electric potential, even when a conductive film is deposited, thus maintaining the Johnsen-Rahbek force.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conductive film is deposited on the wafer and ceramic plate, then the wafer can be held during deposition, but the wafer and ceramic plate reach the same electric potential causing loss of Johnsen-Rahbek force

Engineering Contradiction:
Improvewafer holding reliabilityVSAvoidJohnsen-Rahbek force
Core Design Contradiction:
ReliabilityVSForce

Solution Approach 1:

The patent applies local quality by creating an annular insulating film only in the outer region of the ceramic plate, while the central region remains conductive. This localized differentiation allows the outer edge to maintain potential difference (preserving Johnsen-Rahbek force) while the inner region provides conductive path for wafer holding during deposition.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The insulating film acts as an intermediary element between the conductive ceramic plate and the conductive film deposited on the wafer. It prevents direct electrical contact in the outer region, maintaining potential difference while allowing the system to function as intended.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If the outer circumferential edge of the wafer is placed on the conductive film of the ceramic plate, then alignment is facilitated, but the wafer and ceramic plate have the same electric potential reducing attraction

Engineering Contradiction:
Improvewafer placement easeVSAvoidattracting force
Core Design Contradiction:
Ease of operationVSForce

Solution Approach 1:

The patent creates a spatial differentiation where the outer annular region has insulating properties while the inner region maintains conductive properties. This allows the wafer edge to contact the conductive film for alignment purposes while the insulating outer region prevents potential equalization, preserving the attracting force.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively continues to generate the Johnsen-Rahbek force by maintaining a potential difference between the wafer and the ceramic plate, ensuring consistent attraction and secure holding of the wafer, even during repeated deposition processes and potential misalignment.

Implementation Method 1

An electrostatic chuck that attracts and holds a wafer by Johnsen-Rahbek force is known

Methodology Applied
Scientific EffectJohnsen-Rahbek force: Johnsen-Rahbek Effect

Implementation Method 2

an insulating film with a higher electric resistance than that of the AlN ceramic plate

Methodology Applied
Scientific EffectElectrical resistance: Electrical Resistance

Data Source

PatentUS11223302B2Electrostatic chuck having an annular outer region covered by an insulating film
Publication Date: 2022.01.11 NGK INSULATORS LTD
  • US11223302B2 patent drawing
  • US11223302B2 patent drawing
  • US11223302B2 patent drawing

AI summary

An electrostatic chuck has a structure in which an electrostatic electrode is embedded in a disk-like ceramic plate and attracts a wafer that is placed on the ceramic plate and that has a diameter smaller than that of the ceramic plate by Johnsen-Rahbek force. The electrostatic chuck includes an insulating film that has an electric resistance larger than that of the ceramic plate in an annular region of a front surface of the ceramic plate from an outer circumferential edge of the ceramic plate to the inside of an outer circumferential edge of the wafer that is placed on the ceramic plate.