Electrostatic Chuck Insulation Flow Part Abnormal Discharge
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Solution Overview
Problem
Conventional electrostatic chucks experience abnormal discharge in the gas passage due to exposed inner walls, leading to damage and reduced semiconductor device yield during plasma generation on wafers.
Innovation Solution
An electrostatic chuck design featuring a pedestal part with a gas passage, an insulation substrate, and an insulation flow part formed of insulating material, where the insulation flow part allows gas to flow from the gas passage into a second hole part with a smaller bore diameter, effectively covering the inner walls of the gas passage and preventing abnormal discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high frequency electric power is supplied to the base plate to generate plasma on the wafer surface, then plasma generation is achieved, but abnormal discharge occurs in the gas passage due to exposed inner walls
Solution Approach 1:
An insulating flow part made of insulating material is introduced as an intermediary component within the gas passage. This flow part covers the exposed inner walls of the gas passage, preventing abnormal discharge while allowing gas to flow through it to reach the wafer surface for plasma generation.
Solution Approach 2:
The insulating flow part functions as an insulating shell or film structure that lines the gas passage. This shell-like structure provides electrical insulation along the gas flow path, preventing discharge while maintaining gas flow capability.
2Productivity
If the inner wall of the gas passage is exposed, then gas flow is unobstructed, but abnormal discharge occurs leading to damage and reduced yield
Solution Approach 1:
The insulating flow part serves as a protective intermediary that lines the gas passage interior. It prevents direct contact between the high-frequency electric field and the conductive gas passage walls, eliminating the harmful discharge effect while preserving gas flow for wafer processing.
Solution Approach 2:
The insulating flow part creates an electrically inert environment within the gas passage by providing continuous insulation. This prevents the formation of conductive paths that would lead to abnormal discharge, protecting both the chuck components and the semiconductor wafers from damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents abnormal discharge by enhancing insulation properties between the ceramic substrate and the heater plate, ensuring reliable operation and reducing damage to the chuck and semiconductor wafers during high-frequency power application.
Implementation Method 1
an insulation flow part formed of an insulating material and including a first end provided in the first hole part and a second end provided in the gas passage, wherein the insulation flow part is configured to allow a gas supplied from the gas passage to flow into the second hole part
Implementation Method 2
the insulation flow part is configured to allow a gas supplied from the gas passage to flow into the second hole part
Data Source
AI summary
An electrostatic chuck includes a pedestal part formed of metal and including a gas passage, an insulation substrate mounted on the pedestal part and including a first surface facing the pedestal part and a second surface on an opposite side of the first surface, the first surface including a first hole part communicating with the gas passage, the second surface including a second hole part having a bore diameter less than that of the first hole part and communicating with the first hole part, and an insulation flow part formed of an insulating material and including a first end provided in the first hole part and a second end provided in the gas passage. The insulation flow part is configured to allow a gas supplied from the gas passage to flow into the second hole part.