Electrostatic Chuck Thermal Sprayed Insulator Film
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Solution Overview
Problem
Existing electrostatic chucks face challenges in manufacturing complexity and inadequate cooling performance due to complicated embedding processes and the use of adhesives with poor thermal conductivity, which hinder efficient heat dissipation and insulation reliability.
Innovation Solution
An electrostatic chuck design featuring a metal plate with a thermally sprayed insulator film and a dielectric substrate bonded via an insulative adhesive, where the insulator film has a thickness of 0.6 mm or less and a thermal conductivity of 2 W/mK or more, and the adhesive has a thermal conductivity of 1 W/mK or more, ensuring improved heat transfer and insulation while maintaining flexibility to alleviate shear stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulative adhesive layer is sufficiently thickened to enhance insulation reliability, then insulation reliability is improved, but cooling performance deteriorates because silicone and other resins commonly used as adhesive have poor thermal conductivity
Solution Approach 1:
The patent applies composite materials by combining an insulator film made of ceramic material (such as alumina) with an insulative adhesive layer. The ceramic insulator film provides both electrical insulation and superior thermal conductivity compared to adhesive alone, creating a composite structure that simultaneously achieves high insulation reliability and adequate cooling performance without requiring excessive adhesive thickness.
Solution Approach 2:
The patent changes the material parameters by selecting an insulator film with specific thermal conductivity properties (ceramic material) and controlling its thickness to be 0.6 mm or less. This parameter optimization allows the system to achieve the necessary insulation while maintaining sufficient heat dissipation capability, resolving the trade-off between insulation thickness and cooling performance.
2Ease of manufacture
If a simplified manufacturing process is adopted by forming an electrode on the surface of a dielectric substrate and bonding it to a metal base plate, then manufacturing complexity is reduced, but cooling performance deteriorates due to poor thermal conductivity of insulative adhesives
Solution Approach 1:
The patent introduces a ceramic insulator film as a composite material layer between the metal base plate and dielectric substrate. This ceramic layer has superior thermal conductivity compared to organic adhesives alone, enabling the simplified manufacturing process to maintain adequate cooling performance while keeping the overall structure simple and easy to manufacture.
3Temperature
If an insulator film with thickness of 0.6 mm or less is used to improve cooling efficiency, then cooling performance is improved, but insulation reliability may deteriorate
Solution Approach 1:
The patent uses a composite structure consisting of a thin ceramic insulator film (0.6 mm or less) combined with an insulative adhesive layer. The ceramic film provides high thermal conductivity for cooling while the combination with adhesive maintains sufficient electrical insulation reliability, achieving both cooling efficiency and insulation reliability simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances cooling efficiency and insulation reliability, allowing for effective heat dissipation and uniform temperature control of semiconductor wafers during processing, while simplifying the manufacturing process and reducing production costs.
Implementation Method 1
a metal plate with an insulator film formed on a surface thereof by thermal spraying
Implementation Method 2
the insulator film having a thermal conductivity of 2 W/mK or more
Implementation Method 3
the metal plate and the dielectric substrate being bonded together via an insulative adhesive interposed therebetween
Implementation Method 4
the insulative adhesive having a thermal conductivity of 1 W/mK or more
Implementation Method 5
an electrostatic chuck for attracting a semiconductor substrate or a glass substrate
Data Source
AI summary
An electrostatic chuck includes: a metal plate with an insulator film formed on a surface thereof by thermal spraying; and a dielectric substrate with an electrode formed on a surface thereof. The metal plate and the dielectric substrate are bonded together via an insulative adhesive interposed therebetween so that the insulator film is opposed to the electrode, and the insulator film has a thickness of 0.6 mm or less. Alternatively, An electrostatic chuck includes: a metal plate with an insulator film formed on a surface thereof by thermal spraying; and a dielectric substrate with an electrode selectively formed on a surface thereof. The metal plate and the dielectric substrate are bonded together via an insulative adhesive interposed therebetween so that the insulator film is opposed to the electrode. The insulative adhesive is interposed also between the insulator film and a portion of the surface of the dielectric substrate where the electrode is not formed, and the insulative adhesive has a thermal conductivity of 1 W/mK or more.