Electrostatic Chuck Insulator Plasma Infiltration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrostatic chuck devices face challenges in preventing plasma infiltration through through-holes, leading to adhesion layer deterioration and heat transfer coefficient instability, which can result in dielectric breakdown.
Innovation Solution
The electrostatic chuck device incorporates an insulator with a larger diameter base part through-hole and a plasma-resistant adhesive layer to prevent plasma infiltration, ensuring the adhesion layer remains intact and maintaining uniform heat transfer between the electrostatic chuck and cooling base parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a tubular sleeve is disposed in a through-hole to prevent plasma infiltration, then the adhesion layer is protected from direct plasma exposure, but the heat transfer coefficient control between electrostatic chuck part and cooling base part becomes less uniform
Solution Approach 1:
The patent introduces an insulator as an intermediary component with a stepped structure that has two different inner diameter portions. This stepped insulator serves as a mediator that both prevents plasma from reaching the adhesion layer (protecting it) and maintains proper thermal contact between the electrostatic chuck part and cooling base part (ensuring uniform heat transfer). The first inner diameter portion contacts the electrostatic chuck part while the second inner diameter portion provides plasma shielding, achieving both protection and thermal uniformity simultaneously.
2Object-affected harmful factors
If the base part through-hole has a larger diameter than the chuck part through-hole, then plasma infiltration path is widened, but the insulator can be positioned more effectively to block plasma
Solution Approach 1:
The patent segments the through-hole structure into two distinct portions: a chuck part through-hole penetrating the electrostatic chuck part, and a larger diameter base part through-hole penetrating the cooling base part. This segmentation allows the insulator to be strategically positioned in the enlarged base part through-hole area, where it can effectively block plasma infiltration paths while maintaining proper alignment and contact with both the electrostatic chuck part and cooling base part.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses adhesion layer deterioration and dielectric breakdown, allowing for more uniform heat transfer and improved control of the heat transfer coefficient, preventing short-circuits between plasma and the cooling base.
Implementation Method 1
an insulator provided in the base part through-hole... In order to prevent infiltration of plasma entering through the through-hole, the inner insulator and the electrostatic chuck part inner peripheral surface are in contact with each other
Implementation Method 2
an adhesion layer formed between the electrostatic chuck part and the cooling base part so as to bond the electrostatic chuck part and the cooling base part together
Implementation Method 3
a cooling base part which cools the electrostatic chuck part... maintaining uniform heat transfer between the electrostatic chuck and cooling base parts
Data Source
AI summary
An electrostatic chuck part of an electrostatic chuck device has an electrostatic chuck part inner peripheral surface surrounding an opening of a chuck part through-hole, and an electrostatic chuck part outer peripheral surface surrounding the electrostatic chuck part inner peripheral surface. An insulator has an insulator main body in which an insulator through-hole having an opening on the electrostatic chuck part side is formed, an insulator inner end face, and an insulator outer end face which faces the electrostatic chuck part outer peripheral surface. The insulator inner end face and the electrostatic chuck part inner peripheral surface are in contact with each other, or an adhesion layer or a plasma-resistant adhesive layer extends in a gap between the insulator inner end face and the electrostatic chuck part inner peripheral surface. The plasma-resistant adhesive layer is formed between the electrostatic chuck part outer peripheral surface and the insulator outer end face.