Electrostatic Chuck Panel Interleaved Segments Residual Voltage Control

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Solution Overview

Problem

Existing electrostatic chucks (ESCs) for substrate processing often induce arcing, damage, and non-uniform electrostatic fields, leading to substrate irregularities and contamination, which reduce production yield and affect thin-film transistor films.

Innovation Solution

The design incorporates a substrate carrier with electrostatic chuck panels featuring electrodes in different planes, with asymmetric or symmetric voltage applications to create a uniform residual electrostatic field close to zero, using interleaved segments and varying electrode widths to enhance chucking force and reduce field non-uniformities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If bipolar electrodes are used to create charge separation in the substrate, then chucking force is improved, but arcing and electrode damage occur

Engineering Contradiction:

Improvechucking forceVSAvoidelectrode damage

Core Design Contradiction:

ForceVSReliability

Solution Approach 1:

The electrodes are divided into multiple segments arranged in an interleaved pattern. This segmentation allows the electric field to be distributed across multiple smaller electrode pairs rather than one large bipolar pair, reducing the risk of arcing between any single electrode pair while maintaining overall chucking force through the cumulative effect of all segments.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the electrode structure are assigned different functions: the first and second electrodes in each panel create local charge separation for chucking force, while the alternating polarity arrangement between adjacent panels creates a compensating field that eliminates residual electrostatic fields on the substrate surface, preventing arcing and damage.

Inventive Principle:

Principle #3Local quality

2Force

If bipolar electrodes are used to create charge separation, then chucking force is improved, but contamination is released into the processing environment

Engineering Contradiction:

Improvechucking forceVSAvoidcontamination

Core Design Contradiction:

ForceVSObject-generated harmful factors

Solution Approach 1:

The residual electrostatic field that would normally cause arcing and contamination is converted into a beneficial effect by using alternating polarity on adjacent panels. The compensating field from the second panel cancels the residual field from the first panel, transforming what would be a harmful residual field into a protective mechanism that prevents arcing and contamination.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Force

If electrostatic field is non-uniform across the ESC, then chucking force is achieved, but substrate irregularities occur during processing

Engineering Contradiction:

Improvechucking forceVSAvoidsubstrate flatness

Core Design Contradiction:

ForceVSManufacturing precision

Solution Approach 1:

The electrode structure is segmented into multiple interleaved segments across two panels, allowing the electric field to be distributed uniformly across the substrate surface. This segmentation enables better control of field uniformity while maintaining adequate chucking force through the cumulative effect of all electrode segments.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The structure uses asymmetric arrangement of electrodes in different planes with alternating polarities. The first electrode in the first panel and the second electrode in the second panel are disposed adjacent to each other with different polarities, creating a symmetric overall field distribution that ensures uniform electrostatic force across the substrate surface.

Inventive Principle:

Principle #4Asymmetry

4Force

If residual electrostatic field remains on substrate surface, then chucking is maintained, but thin-film transistor films are adversely affected

Engineering Contradiction:

Improvechucking forceVSAvoidfilm quality

Core Design Contradiction:

ForceVSObject-affected harmful factors

Solution Approach 1:

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures a high and uniform chucking force while minimizing residual electrostatic fields on the substrate surface, improving processing uniformity and reducing the risk of damage, thereby enhancing production yield and film quality.

Implementation Method 1

The first electrode has a first plurality of segments residing in a single plane and connecting at first corners is interleaved with the second electrode... applying a first voltage to a first electrode of the electrostatic chuck panel, applying a second voltage to a second electrode of the electrostatic chuck panel that is disposed farther from the substrate than the first electrode

Methodology Applied

Scientific EffectElectrostatic force: Electrostatics

Implementation Method 2

The charge separation induced in the substrate by the ESC creates an electrostatic chucking force with the oppositely charged electrode disposed in the ESC, thereby securing the substrate to the substrate support surface

Methodology Applied

Scientific EffectElectrostatic induction: Electrostatic Induction

Data Source

PatentUS11024529B2System and method for residual voltage control of electrostatic chucking assemblies

Publication Date: 2021.06.01 APPLIED MATERIALS INC

AI summary

Described herein is a substrate carrier comprising electrostatic chuck panels and using the same. The electrostatic chuck panels may include electrodes with interleaved segments. Further, the electrodes of each electrostatic chuck panel may be driven with chucking voltages having opposite polarities.