Multi-Electrode Electrostatic Chuck With Brazed Isolation Grooves
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Solution Overview
Problem
Existing methods for manufacturing semiconductor substrate supports with multiple chucking electrodes are costly and time-intensive, and there is a need for a more efficient process that can produce high-quality electrostatic chucks with improved electrical isolation and hermetic sealing.
Innovation Solution
A method involving the joining of ceramic layers with a high-purity aluminum metal joining layer, where the layers are pre-metallized and brazed together at elevated temperatures in a vacuum atmosphere, followed by machining of exclusion patterns and filling with dielectric material to create isolated electrode portions, resulting in a hermetic seal and enhanced electrostatic attraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional methods are used to manufacture semiconductor substrate supports with multiple chucking electrodes, then the structural integrity and electrical isolation can be maintained, but the manufacturing process becomes costly and time-intensive
Solution Approach 1:
The patent applies preliminary action by pre-metallizing the ceramic layers with aluminum before joining them. This pre-application of the metal layer simplifies the subsequent brazing process and enables the formation of electrode portions without requiring complex post-joining metal deposition steps, thereby reducing manufacturing time and cost while maintaining electrical isolation
Solution Approach 2:
The patent merges multiple functions into the metal joining layer: it serves as both the bonding agent between ceramic layers and the electrode material itself. By combining the joining function and electrode function into a single layer, the patent eliminates the need for separate electrode deposition processes, improving manufacturing efficiency without compromising electrical isolation when combined with dielectric filling
2Productivity
If ceramic layers are joined with metal joining layer to create electrode portions, then manufacturing cost and time are reduced, but achieving hermetic sealing and electrical isolation becomes more challenging
Solution Approach 1:
The patent uses dielectric material as an intermediary substance filled into grooves within the metal joining layer. This dielectric filler acts as a mediator that provides electrical isolation between adjacent electrode portions while allowing the metal layer to maintain its structural and conductive functions, thereby achieving both manufacturing efficiency and reliable electrical isolation
Solution Approach 2:
The patent segments the metal joining layer by creating grooves that divide it into distinct electrode portions. This segmentation, combined with dielectric filling, ensures electrical isolation between electrodes while maintaining the overall integrity of the joining structure, resolving the contradiction between simplified manufacturing and reliable electrical isolation
3Manufacturing precision
If high-purity aluminum is used as joining material with pre-metallized ceramic layers, then electrostatic chuck performance is enhanced, but the joining process requires elevated temperatures in vacuum atmosphere increasing process complexity
Solution Approach 1:
The patent utilizes parameter changes by controlling the brazing temperature (elevated temperature in vacuum atmosphere) to achieve proper metallurgical bonding of the aluminum layer to the ceramic substrates. This controlled parameter change enables the aluminum to form a hermetic, electrically isolating joint that precisely defines electrode boundaries, achieving high manufacturing precision despite the complex joining process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing costs and time while achieving high electrostatic chuck performance, with the ability to withstand high voltages without cross-talk and maintaining material properties of the ceramic layers, ensuring precise and efficient semiconductor substrate support.
Implementation Method 1
joining a first ceramic layer to a second ceramic layer with a metal joining layer... pre-metallized and brazed together at elevated temperatures in a vacuum atmosphere
Implementation Method 2
enhanced electrostatic attraction... withstand high voltages without cross-talk
Data Source
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AI summary
A method for manufacturing an electrostatic chuck, comprising joining a first ceramic plate to a second ceramic plate with a metal joining layer. At least one groove is formed extending through the first ceramic plate and through the metal joining layer to provide at least one electrode portion formed from the metal joining layer. The at least one groove in at least the metal joining layer is filled with a dielectric material to electrically isolate the at least one electrode portion. An electrostatic chuck or other structure manufactured by such method can be provided.