Electrostatic Chuck Joining Layer for Heat Transfer Without Peeling
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Solution Overview
Problem
In electrostatic chucks used in semiconductor manufacturing, the increased energy incidents on wafers and dielectric substrates lead to higher cooling demands, resulting in a need for higher thermal conductivity in joining layers. However, excessive filler content in these layers reduces flexibility, causing peeling issues due to thermal expansion differences.
Innovation Solution
The electrostatic chuck incorporates a joining layer with a particulate filler content equal to or lower than 70% by weight, ensuring sufficient flexibility even in low-temperature environments and reducing the likelihood of peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the content of filler materials in the joining layer is increased to improve heat transfer performance, then thermal conductivity is improved, but flexibility abruptly decreases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the filler material content to be 70% by weight or less, maintaining an optimal balance between thermal conductivity and flexibility. This quantitative parameter control prevents the abrupt flexibility decrease that occurs when filler content exceeds the threshold, while still achieving sufficient heat transfer performance for the cooling requirements.
2Temperature
If the content of filler materials in the joining layer is increased to improve heat transfer performance, then thermal conductivity is improved, but peeling likelihood increases
Solution Approach 1:
The patent uses parameter changes by setting the filler material content at 70% by weight or less, which maintains adequate thermal conductivity while preventing the peeling issue. This parameter optimization ensures that the joining layer retains sufficient flexibility to accommodate thermal expansion differences between the dielectric substrate and base plate, thereby preventing peeling under thermal stress.
3Temperature
If the cooling performance of the base plate is increased to handle higher energy incidents, then temperature control is improved, but the joining layer requires higher thermal conductivity which reduces flexibility
Solution Approach 1:
The patent applies local quality by optimizing the filler material distribution and content specifically in the joining layer to achieve the required thermal conductivity for effective cooling, while maintaining flexibility through the 70% by weight threshold. This localized optimization allows the base plate to provide enhanced cooling performance without compromising the joining layer's mechanical properties.
Solution Approach 2:
The patent uses parameter changes by controlling the filler material content at 70% by weight or less in the joining layer, enabling the system to achieve sufficient thermal conductivity for improved cooling performance while preventing the flexibility loss that would otherwise occur with higher filler content.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
By maintaining the filler content below 70% by weight, the joining layer's flexibility is secured, preventing peeling and ensuring reliable operation of the electrostatic chuck under increased cooling demands.
Implementation Method 1
When a voltage is applied to the attraction electrode, an electrostatic force is generated, and the wafer placed on the dielectric substrate is attracted and held
Implementation Method 2
A joining layer which joins the dielectric substrate and the base plate has been required to have higher heat transfer performance than before
Data Source
AI summary
An electrostatic chuck 10 includes a dielectric substrate 100, a base plate 200, and a joining layer 300 which joins the dielectric substrate 100 and the base plate 200. The joining layer 300 is obtained by containing a plurality of particulate filler materials 320 inside resin 310. The content of the filler materials 320 in the joining layer 300 is equal to or lower than 70% by weight.