Electrostatic Chuck Lamination Layer Insulation Design
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Solution Overview
Problem
Existing substrate placing tables experience electric discharges when voltage is applied, particularly at low frequencies, due to insufficient insulation resistance and electrostatic capacity, leading to potential substrate damage and processing inefficiencies.
Innovation Solution
The substrate placing table incorporates a lamination layer with a resin layer and a ceramics covering layer, which increases the electrostatic capacity and reduces the voltage phase difference, thereby suppressing electric discharges by maintaining high insulation resistance even with reduced layer thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single-layer insulating structure is used, then the structure is simple, but the insulation resistance is insufficient leading to electric discharges
Solution Approach 1:
The patent applies composite materials by creating a multi-layer insulating structure consisting of a first insulating layer (yttrium oxide) and a second insulating layer (alumina). This composite structure combines materials with different dielectric properties to achieve higher overall insulation resistance and electrostatic capacity than a single layer could provide, thereby preventing electric discharges while maintaining structural integrity.
Solution Approach 2:
The patent segments the insulating structure into multiple distinct layers with different materials and functions. The first insulating layer provides base insulation, while the second insulating layer enhances the overall insulation resistance. This segmentation allows each layer to be optimized for specific requirements, resulting in superior overall performance compared to a homogeneous single layer.
2Use of energy by moving object
If voltage is applied at low frequency, then energy consumption is reduced, but electric discharges occur due to insufficient electrostatic capacity
Solution Approach 1:
The multi-layer composite insulating structure increases the overall electrostatic capacity of the electrostatic chuck. This enhanced capacity allows the system to maintain effective electrostatic attraction at lower voltages and frequencies, reducing energy consumption while preventing electric discharges that would occur with insufficient capacity.
Solution Approach 2:
The patent changes the dielectric parameters of the insulating structure by introducing a second insulating layer with different material properties. This increases the overall dielectric constant and electrostatic capacity, enabling the system to operate effectively at lower frequencies without experiencing electric discharges, thus optimizing energy consumption.
3Length of stationary object
If the insulating layer thickness is reduced, then the device size is smaller, but the insulation resistance decreases causing electric discharges
Solution Approach 1:
The patent uses composite materials in a multi-layer configuration where each layer contributes to the overall insulation performance. This allows the total thickness to be reduced while maintaining or even improving insulation resistance, as the composite structure provides better electrical properties per unit thickness than a single homogeneous layer.
Solution Approach 2:
The patent employs asymmetric layer design where the two insulating layers have different thicknesses and material compositions optimized for their specific roles. This asymmetric configuration allows efficient space utilization while maintaining high insulation resistance, achieving better performance than a symmetric single-layer design of equivalent total thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the potential between the substrate and the base, minimizing electric discharges and ensuring reliable substrate processing, even at low frequencies, thus enhancing processing efficiency and preventing substrate damage.
Implementation Method 1
The electrostatic chuck electrostatically attracts the wafer to the placing table by an electrostatic force. In the electrostatic chuck, voltage is applied to the electrode layer, whereby an electrostatic force is generated between the electrode layer and the object to be treated
Implementation Method 2
The substrate placing table incorporates a lamination layer with a resin layer and a ceramics covering layer, which increases the electrostatic capacity and reduces the voltage phase difference, thereby suppressing electric discharges by maintaining high insulation resistance
Implementation Method 3
The intermediate layer is provided between the second layer and the covering layer and is in close contact with the second layer and the covering layer, maintaining high insulation resistance
Data Source
AI summary
A substrate placing table according to an exemplary embodiment includes a base and an electrostatic chuck provided on the base. The electrostatic chuck includes a lamination layer portion, an intermediate layer, and a covering layer. The lamination layer portion is provided on the base. The intermediate layer is provided on the lamination layer portion. The covering layer is provided on the intermediate layer. The lamination layer portion includes a first layer, an electrode layer, and a second layer. The first layer is provided on the base. The electrode layer is provided on the first layer. The second layer is provided on the electrode layer. The intermediate layer is provided between the second layer and the covering layer and is in close contact with the second layer and the covering layer. The second layer is a resin layer. The covering layer is ceramics.