Electrostatic Chuck Hole Layout for Faster Laser Substrate Etching

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Solution Overview

Problem

Existing laser processing apparatuses face challenges in efficiently processing display devices with reduced bezel areas, leading to increased process time and potential reliability issues.

Innovation Solution

A laser processing apparatus is designed with a stage, an electrostatic chuck, and a laser irradiation unit, where the electrostatic chuck has holes that overlap the etching regions of the target substrate, allowing for efficient processing and minimizing process delays.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the electrostatic chuck is replaced frequently to maintain processing quality, then manufacturing precision is improved, but loss of time increases due to replacement operations

Engineering Contradiction:
Improveflatness maintenanceVSAvoidreplacement time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The electrostatic chuck is segmented into a modular structure with a body portion and a separate electrode assembly. The electrode can be independently replaced or adjusted without replacing the entire chuck, reducing replacement time while maintaining processing precision through easy electrode renewal.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Backup electrodes or electrode assemblies are prepared in advance and stored ready for immediate installation. When electrode wear or damage occurs, the pre-prepared replacement electrode can be quickly installed without delay, maintaining both precision and minimizing downtime.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If the laser processing apparatus operates continuously to improve productivity, then productivity increases, but reliability decreases due to potential power failures causing process interruption

Engineering Contradiction:
Improveprocessing throughputVSAvoidprocess continuity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The system incorporates backup power supply mechanisms and automatic process saving functions that activate before actual power failures occur. These preventive measures ensure that continuous operation can be maintained or safely resumed after power interruptions without compromising process reliability or productivity.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The control system continuously monitors operational status and provides real-time feedback on processing progress. In case of power failure, this feedback mechanism enables automatic resumption of the exact same processing parameters and position after power restoration, ensuring reliability while maintaining high productivity through uninterrupted workflow.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus reduces process time, improves reliability by maintaining flatness during electrostatic chuck replacement, and minimizes losses due to power failures by ensuring continuous processing.

Implementation Method 1

an electrostatic chuck disposed on the stage and including a plurality of holes; and a laser irradiation unit disposed above the stage and spaced apart from the stage and irradiating a laser beam on the target substrate, wherein a surface of the electrostatic chuck is in contact with the target substrate

Methodology Applied
Scientific EffectElectrostatic attraction: Electrostatics

Data Source

PatentUS12202078B2Laser processing apparatus
Publication Date: 2025.01.21 SAMSUNG DISPLAY CO LTD
  • US12202078B2 patent drawing
  • US12202078B2 patent drawing
  • US12202078B2 patent drawing

AI summary

A laser processing apparatus includes a stage configured to transfer a target substrate and including an opening, an electrostatic chuck disposed on the stage and including a plurality of holes, and a laser irradiation unit disposed above the stage and spaced apart from the stage and configured to irradiate a laser beam on the target substrate. A surface of the electrostatic chuck is in contact with the target substrate, the target substrate includes a plurality of etching regions to be etched by the laser beam and a non-etching region surrounding the plurality of etching regions of the target substrate, and the plurality of holes of the electrostatic chuck overlap the opening of the stage and the plurality of etching regions of the target substrate.