Electrostatic Chuck and Magnet Plate Substrate Alignment
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Solution Overview
Problem
Existing deposition processes face challenges in maintaining uniformity and accuracy due to substrate slackness, leading to non-uniform thin film patterns and increased deposition failures, especially in high-resolution applications.
Innovation Solution
A deposition apparatus and method utilizing an electrostatic chuck and a magnet plate to securely attach and align substrates using static and magnetic forces, preventing substrate slackness and ensuring precise pattern alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the mask and substrate are separated during deposition, then the deposition process is easier to operate, but the thin film pattern becomes non-uniform and the shape extends beyond the slit outline
Solution Approach 1:
The substrate is pre-mounted on the mask before deposition, ensuring proper alignment and close proximity are established in advance. This preliminary positioning prevents pattern non-uniformity during the actual deposition process while maintaining ease of operation through automated substrate handling.
Solution Approach 2:
The mask serves as an intermediary structure that holds the substrate in the correct position relative to the deposition source. By mounting the substrate on the mask rather than separately positioning it, the system maintains precise pattern definition while simplifying the deposition operation.
2Ease of manufacture
If the substrate is not securely attached, then the installation process is simpler, but the substrate becomes slack causing changes in hole pattern locations and deposition failures
Solution Approach 1:
The substrate is pre-mounted on the mask frame with proper positioning before the deposition process begins. This preliminary attachment ensures the substrate maintains correct positioning throughout deposition, preventing slack-induced pattern location changes while keeping the installation process simple through automated mounting.
Solution Approach 2:
The patent replaces traditional mechanical clamping systems with a magnetic field-based attachment system. The magnet plate securely holds the substrate on the mask without complex mechanical fasteners, achieving reliable substrate fixation while simplifying the installation process.
3Device complexity
If traditional mechanical attachment methods are used, then the device structure is simpler, but the substrate alignment precision and flatness control are insufficient for high-resolution deposition
Solution Approach 1:
The patent replaces mechanical attachment and alignment systems with electromagnetic fields. The electrostatic chuck provides precise substrate positioning through electric fields, while the magnet plate ensures secure attachment. This substitution achieves high alignment precision and flatness control necessary for high-resolution deposition without significantly increasing device complexity.
Solution Approach 2:
The system uses controllable electromagnetic parameters (electric field strength, magnetic field intensity) to precisely adjust substrate position and attachment force. By changing these parameters, the system achieves accurate alignment and flatness control for high-resolution deposition patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances deposition location accuracy, reduces failure rates, improves productivity, and lowers production costs by maintaining substrate flatness and consistent pattern alignment.
Implementation Method 1
an electrostatic chuck attached to a bottom surface of the metal sheet and absorbing a substrate using a static electricity force
Implementation Method 2
a magnet plate provided above the metal sheet, and attaching the substrate to the electrostatic chuck by pulling the metal mask using a magnetic force
Data Source
AI summary
A deposition apparatus is disclosed. In one aspect, the apparatus includes a metal sheet of which an edge portion is integrally combined with a sheet frame and an electrostatic chuck attached to a bottom surface of the metal sheet and configured to pull a substrate based on a static electricity force. The apparatus also includes a metal mask placed below the electrostatic chuck, wherein an edge portion of the metal mask is combined with a mask frame, and wherein the metal mask has a predetermined patterned opening where the substrate is mounted to the upper surface thereof. The apparatus further includes a magnet plate placed above the metal sheet, and configured to pull the metal mask based on a magnetic force so as to attach the substrate to the electrostatic chuck.