Electrostatic Chuck Masking Electrode for Arc-Free Biasing
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Solution Overview
Problem
The formation of excessive electric fields near sharp conductive pins used in semiconductor wafer evaluation systems, which can lead to damage of electron optics and other components due to high voltage arcs, is a challenge that existing technologies have not adequately addressed.
Innovation Solution
An electrostatic chuck is designed with a masking electrode that reduces the electric field generated by the sharp conductive element, using a movement unit to position the masking electrode in a way that minimizes the electric field when the sharp conductive element is biased, thereby preventing arcs from forming.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sharp conductive pin is used to bias the electrostatic chuck, then electrical connection and biasing capability are improved, but excessive electric field formation and arcing damage occur
Solution Approach 1:
A masking electrode is introduced as an intermediary component between the sharp conductive pin and the electron optics. This masking electrode has a rounded surface that redistributes the electric field, acting as a mediator that maintains the electrical connection function while eliminating the harmful field concentration effect of the sharp pin.
Solution Approach 2:
The masking electrode is positioned specifically at the location where electric field concentration occurs (near the sharp conductive pin). By applying this local solution only where needed, the patent maintains the sharp pin's electrical connection function while locally modifying the electric field distribution to prevent arcing.
2Adaptability or versatility
If the electrostatic chuck operates without a semiconductor wafer, then system testing and calibration are enabled, but the sharp conductive pin is exposed to electron optics causing potential damage
Solution Approach 1:
The masking electrode serves as a protective intermediary that allows the electrostatic chuck to operate in testing mode without a wafer. It blocks the direct exposure of the sharp conductive pin to the electron optics while maintaining the electrical biasing function needed for testing.
Solution Approach 2:
The masking electrode is positioned in advance to cover the sharp conductive pin before any potential arcing can occur. This preliminary protective action enables safe operation during system testing and calibration procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrostatic chuck effectively mitigates the formation of arcs, protecting electron optics and other components from damage by significantly reducing the electric field strength, ensuring the integrity of the evaluation system.
Implementation Method 1
A masking electrode is provided. A movement unit is configured to position the masking electrode in a masking position in which the masking electrode reduces an electric field formed by the sharp conductive element
Data Source
AI summary
An electrostatic chuck, that includes (a) an electrostatic chuck body having a top surface and being configured to support a sample; (b) a space formed within the electrostatic chuck body, the space has a top opening; (c) a sharp conductive element; (d) a masking electrode; and (e) a movement unit that is configured to position the masking electrode in a masking position in which the masking electrode reduce an electric field formed by the sharp conductive element when the sharp conductive element is being biased and the top opening is not covered by a backside of the sample.