Electrostatic Chuck Flow Path Geometry for Misalignment-Tolerant Cooling

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Solution Overview

Problem

In the manufacturing of electrostatic chucks, misalignment of the coolant flow path can lead to deviations in the temperature distribution on the placement surface, compromising the design intent and the uniformity of temperature control.

Innovation Solution

The electrostatic chuck incorporates a ceramic dielectric substrate and a base plate with a communicating path that includes alternately arranged convex and concave portions on its side surfaces, which helps to minimize temperature distribution deviations even when the coolant flow path is misaligned during manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a straight coolant flow path is used in the base plate, then the manufacturing process is simple, but misalignment during manufacturing causes temperature distribution deviations on the placement surface

Engineering Contradiction:

Improvecoolant flow path fabricationVSAvoidflow path alignment

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The coolant flow path is segmented into multiple sections with convex and concave portions that create a meandering pattern. This segmentation allows the flow path to accommodate manufacturing misalignments by distributing the coolant flow across multiple segments, reducing the impact of any single misalignment on overall temperature uniformity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The flow path transitions from a simple linear configuration to a meandering pattern that utilizes both longitudinal and lateral dimensions. By adding the lateral dimension through convex and concave portions, the design creates redundancy that compensates for manufacturing variations in the longitudinal direction

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the coolant flow path is designed with high precision alignment, then temperature distribution uniformity is improved, but the manufacturing complexity and cost increase

Engineering Contradiction:

Improveflow path alignmentVSAvoidcoolant flow path structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The design changes the geometric parameters of the flow path by introducing convex and concave portions with specific dimensions. These parameter changes create a meandering pattern that inherently compensates for misalignment, achieving robust temperature control without requiring ultra-precise manufacturing tolerances

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The design converts the potential harm of manufacturing misalignment into a benefit by using the meandering pattern to distribute and average out temperature variations. The convex and concave portions act as compensatory features that transform positioning errors into beneficial flow distribution patterns

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively suppresses temperature distribution deviations, ensuring a more uniform temperature control on the placement surface and enhancing the robustness of temperature management despite manufacturing inaccuracies.

Implementation Method 1

the electrostatic chuck applies an electrostatic clamping power to embedded electrodes and clamps a substrate such as a silicon wafer or the like by an electrostatic force

Methodology Applied

Scientific EffectElectrostatic force: Electrostatics

Implementation Method 2

A coolant flow path may be provided in the base plate to cool the process object

Methodology Applied

Scientific EffectConvection cooling: Convection

Implementation Method 3

The communicating path is configured to allow a coolant to pass

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230311258A1Electrostatic chuck

Publication Date: 2023.10.05 TOTO LTD

AI summary

An electrostatic chuck includes a ceramic dielectric substrate and a base plate. The base plate includes a communicating path configured to allow a coolant to pass. The communicating path includes a first flow path part having a pair of side surfaces along a first direction. The first direction is along a flow of the coolant. When viewed along a stacking direction, one side surface of the pair of side surfaces includes a plurality of convex portions and a plurality of concave portions. The plurality of convex portions is convex in a second direction. The second direction is perpendicular to the first direction. The second direction is from the other side surface toward the one side surface of the pair of side surfaces. The plurality of concave portions is convex in an opposite direction of the second direction.