Electrostatic Chuck Cooling Plate Channels for Lower Thermal Gradient
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Solution Overview
Problem
In electrostatic chuck devices used in semiconductor manufacturing, a temperature gradient in the cooling plate can cause thermal stress, potentially cracking the wafer or damaging the clamping plate.
Innovation Solution
The electrostatic chuck device incorporates a cooling plate with an internal flow channel that forms a flow channel geometry where flow channel elements of an identical pattern are systematically connected, allowing coolant to flow meanderingly from the central to the outer peripheral portion, reducing temperature differences and gradients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a simple linear flow channel is used in the cooling plate, then the device complexity is reduced and manufacturing is easier, but a large temperature gradient is generated causing thermal stress and potential damage
Solution Approach 1:
The flow channel is divided into multiple flow channel elements arranged in a systematic pattern. Each element is a separate segment that collectively forms the complete flow path, allowing the coolant to distribute heat more uniformly across the clamping plate while maintaining manufacturing simplicity through modular construction
Solution Approach 2:
The flow channel elements are arranged asymmetrically in a systematic pattern that creates a meandering flow path. This asymmetric arrangement ensures the coolant traverses both central and outer peripheral portions of the cooling plate, reducing temperature gradients without requiring complex channel geometries
2Reliability
If the coolant flow path is extended to cover the entire cooling plate area, then temperature uniformity is improved, but the flow channel complexity and manufacturing difficulty increase
Solution Approach 1:
The complex meandering flow path is extracted into separate, identical flow channel elements that can be manufactured independently. These elements are then systematically arranged to form the complete flow channel, simplifying fabrication while achieving comprehensive cooling coverage
Solution Approach 2:
Each flow channel element has a simple, standardized local geometry that is easy to manufacture. The systematic arrangement of these identical elements creates the overall complex flow pattern needed for uniform temperature distribution, combining local simplicity with global complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the temperature gradient across the clamping plate, ensuring a uniform temperature for the target object, while also enhancing the mechanical strength and simplifying the design and processing of the cooling plate.
Implementation Method 1
A coolant flows through an internal flow channel formed in the cooling plate, and cools the wafer clamped to the clamping plate
Implementation Method 2
a metallic cooling plate which is in contact with a back surface of the clamping plate
Implementation Method 3
an electrostatic chuck device which clamps a target object via an electrostatic force
Data Source
AI summary
The present invention is an electrostatic chuck device which makes a temperature of a target object clamped to a clamping plate uniform and clamps the target object via an electrostatic force, including: a clamping plate having a clamping surface that clamps a target object to its front surface side; and a cooling plate which is provided on a back surface side of the clamping plate and which has an internal flow channel through which a coolant flows, in which the internal flow channel forms a flow channel geometry in which flow channel elements of an identical pattern in a plan view are systematically connected.