Electrostatic Chuck Substrate Support for Large OLED Deposition
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Solution Overview
Problem
Conventional thin film deposition methods for organic light-emitting display devices face challenges with large substrates, as fine metal masks (FMMs) tend to bend and distort patterns, and substrates sag due to inadequate support, making high-pitch patterning and large-scale manufacturing difficult.
Innovation Solution
A thin film deposition apparatus utilizing an electrostatic chuck with power source plugs and a carrier system to maintain substrate stability and support, combined with a deposition assembly featuring a patterning slit sheet and deposition source nozzles, allows for stable deposition on large substrates by moving the substrate relative to the deposition assembly, preventing mask contact and sagging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fine metal mask (FMM) is used for deposition onto a large sized mother-glass, then the thin film pattern can be formed, but the mask is likely to bend due to the weight thereof, thereby causing a pattern to be distorted
Solution Approach 1:
The patent replaces the mechanical contact system (FMM physically contacting the substrate) with a non-contact deposition system. The deposition assembly is positioned at a predetermined distance from the substrate, eliminating the mechanical weight burden on the mask while maintaining precise pattern formation through controlled material deposition onto the substrate surface.
Solution Approach 2:
The patent transitions from a two-dimensional contact system (mask flat against substrate) to a three-dimensional non-contact system. By separating the deposition assembly from the substrate in the vertical dimension and controlling deposition through spatial positioning and material flow, the system achieves precise patterning without mechanical contact, preventing mask bending.
2Ease of operation
If only the edges of the substrate are supported by a chuck, then the substrate can be held, but a central part of the substrate may sag when the substrate is large
Solution Approach 1:
The patent replaces the mechanical edge-support system with an electrostatic field-based support system. The electrostatic chuck generates an electric field that acts across the entire substrate surface, providing uniform support force distribution from the chuck surface to the substrate, eliminating central sagging while maintaining ease of substrate handling.
Solution Approach 2:
The substrate is affixed to the electrostatic chuck before the deposition process begins. This preliminary affixing action ensures the substrate is properly positioned and supported across its entire surface area, preventing any sagging during the subsequent deposition operation and ensuring manufacturing precision.
3Area of stationary object
If a large mask is used for deposition onto a large sized mother-glass, then the entire substrate can be covered, but the mask is likely to bend due to the weight thereof
Solution Approach 1:
The patent replaces the large mechanical mask with a non-contact deposition assembly that can cover the entire substrate area. The assembly deposits material onto the substrate surface without physical contact, achieving full substrate coverage while eliminating the weight-induced bending problems associated with large mechanical masks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, high-pitch patterning and large-scale manufacturing of organic light-emitting display devices with improved substrate support and reduced manufacturing time, while maintaining deposition uniformity and preventing defects.
Implementation Method 1
an electrode embedded into the body and applying an electrostatic force to the substrate through a supporting surface
Implementation Method 2
at least one thin film deposition assembly... used to form a thin film on the substrate affixed to the electrostatic chuck
Data Source
AI summary
A thin film deposition apparatus and an organic light-emitting display device by using the same. The thin film deposition apparatus includes an electrostatic chuck, a plurality of chambers; at least one thin film deposition assembly; a carrier; a first power source plug; and a second power source plug. The electrostatic chuck includes a body having a supporting surface that contacts a substrate to support the substrate, wherein the substrate is a deposition target; an electrode embedded into the body and applying an electrostatic force to the supporting surface; and a plurality of power source holes formed to expose the electrode and formed at different locations on the body.