Electrostatic Chuck for OLED Substrate Attachment

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Solution Overview

Problem

The existing methods for fabricating organic light emitting devices face challenges in achieving uniform flatness and close attachment of substrates, leading to reduced yield and increased fabrication costs, especially with the trend towards larger devices, which can result in reduced lifespan and reliability due to uneven pressure application.

Innovation Solution

An attaching device with a process chamber, substrate supporters, and an open-close valve is used, where at least one supporter features an electrostatic chuck with multiple electrodes of different polarities and a polarity inverting unit to securely load and align substrates using electrostatic forces, followed by applying atmospheric pressure to ensure proper attachment and sealing with a sealant.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If physical pressure is applied to attach substrates inside a process chamber, then substrates can be attached together, but uniform flatness between substrate supporters cannot be maintained and close attachment of entire surfaces is difficult

Engineering Contradiction:

Improveattachment uniformityVSAvoidprocess yield

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent replaces the mechanical pressure application system with an electrostatic field-based system. Electrostatic chucks use electric fields to hold and attach substrates without mechanical contact or pressure application, eliminating the problems of non-uniform flatness and incomplete surface attachment while improving manufacturing precision and process yield.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical parameter from mechanical pressure to electrostatic field strength for substrate attachment. By controlling the electrostatic field parameters (voltage, charge distribution), uniform attachment across the entire substrate surface is achieved, resolving the contradiction between attachment effectiveness and uniformity.

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If pressure is applied to attach two substrates, then substrates can be joined, but large-sized devices may be damaged and lifespan is reduced

Engineering Contradiction:

Improvesubstrate attachmentVSAvoiddevice lifespan

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent substitutes mechanical pressure application with electrostatic field-based attachment using electrostatic chucks. This eliminates direct mechanical pressure on the substrates, preventing damage to large-sized devices while maintaining effective attachment, thereby extending device lifespan and improving reliability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If substrates are attached using existing methods, then fabrication can proceed, but yield is reduced and fabrication cost increases

Engineering Contradiction:

Improvefabrication efficiencyVSAvoidsubstrate attachment quality

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical pressure attachment with electrostatic field-based attachment using electrostatic chucks. This provides superior attachment quality with uniform flatness and complete surface contact, reducing defects and rework, thereby increasing fabrication yield and reducing costs despite the added complexity of the electrostatic system.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances the yield and lifespan of organic light emitting devices by ensuring precise and uniform attachment of substrates, minimizing damage from pressure and impurities, and improving the reliability of the manufacturing process.

Implementation Method 1

safely loading and fixing the substrates by electrostatic force

Methodology Applied

Scientific EffectElectrostatic force: Electrostatics

Implementation Method 2

detaching the second substrate from the second substrate supporter through inverting a polarity of electrostatic force

Methodology Applied

Scientific EffectElectrostatic force inversion: Electrostatics

Implementation Method 3

injecting an air into the process chamber through the open-close valve to apply atmosphere pressure to the outside of the attached first and second substrates

Methodology Applied

Scientific EffectAtmospheric pressure: Pressure Increase

Data Source

PatentUS7799584B2Attaching device and method of fabricating organic light emmiting device using the same

Publication Date: 2010.09.21 LG DISPLAY CO LTD

AI summary

An attaching device and a method of manufacturing a light emitting device using the same are provided. The attaching device includes a process chamber, first and second supporters, and an open-close valve. The first and second supporters are disposed inside the process chamber to safely load and fix substrates. The open-close valve is disposed at a predetermined area of the process chamber to control a pressure inside the process chamber by opening and closing the process chamber. At least one of the first and second substrate supporters includes an electro static chuck including more than two of electrodes having different polarities and a polarity inverting unit for inverting polarities of the electrodes.