Electrostatic Chuck Pin-Hole Insulation for Bond Layer Protection
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Solution Overview
Problem
Conventional electrostatic chucks suffer from deformation of the bonding layer and damage to the lift pin due to plasma exposure and heat strain differences between the ceramic puck and the base plate.
Innovation Solution
The electrostatic chuck design includes an insulating pipe with an upper insulating pipe bonded to the ceramic puck and a lower insulating pipe adhered to the base plate, preventing exposure of the bonding layer to plasma and minimizing heat strain-induced warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the insulating pipe is inserted into the pin hole in a state of being adhered to a bonding layer, then the insulating pipe can be easily installed, but the bonding layer may be deformed due to plasma and the insulating pipe may be warped due to heat strain
Solution Approach 1:
The insulating pipe is divided into two separate parts: an upper insulating pipe bonded to the ceramic puck and a lower insulating pipe adhered to the base plate. This segmentation allows each part to be independently positioned and secured, preventing the bonding layer from being deformed during installation while ensuring proper insulation and structural support.
Solution Approach 2:
The upper insulating pipe acts as an intermediary element between the ceramic puck and the lower insulating pipe. It is bonded to the ceramic puck and provides a mounting surface for the lower insulating pipe, thereby protecting the bonding layer from direct exposure to plasma and heat strain while ensuring stable installation.
2Productivity
If the bonding layer is exposed to plasma, then the plasma processing can be performed, but the bonding layer may be deformed
Solution Approach 1:
The bonding layer is extracted from the plasma environment by positioning it beneath the upper insulating pipe, which is bonded to the ceramic puck. This extraction protects the bonding layer from plasma exposure while maintaining the plasma processing capability through the insulating pipe structure.
Solution Approach 2:
The upper insulating pipe serves as a mediator that allows plasma to pass through or around it while protecting the bonding layer from direct plasma contact. This enables plasma processing to continue while preserving the bonding layer's integrity.
3Device complexity
If the ceramic puck and base plate are bonded directly, then the structure is simple, but the insulating pipe may be warped due to difference in heat strain
Solution Approach 1:
The insulating pipe structure is segmented into upper and lower parts with different mounting positions. The upper insulating pipe is bonded to the ceramic puck while the lower insulating pipe is adhered to the base plate, allowing each part to accommodate heat strain independently and preventing warpage.
Solution Approach 2:
Different parts of the insulating pipe structure are given different properties and mounting methods. The upper insulating pipe is bonded to the ceramic puck with specific thermal properties, while the lower insulating pipe is adhered to the base plate, allowing each location to handle heat strain appropriately and preventing overall warpage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents deformation of the bonding layer and damage to the lift pin, ensuring reliable operation of the electrostatic chuck during plasma processing.
Implementation Method 1
the upper insulating pipe may include a bonding portion brazed to an inner side wall of the pin hole in the ceramic puck
Implementation Method 2
a bonding layer configured to bond the ceramic puck to the base plate
Implementation Method 3
a lower insulating pipe adhered to the base plate
Implementation Method 4
an electrostatic chuck configured to support a substrate
Data Source
AI summary
Disclosed are an electrostatic chuck capable of preventing deformation of a bonding layer and damage to a lift pin, a method of manufacturing the electrostatic chuck, and a plasma processing apparatus. The electrostatic chuck configured to support a substrate and to receive a lift pin so that the lift pin is ascendable and descendable therein includes at least one pin hole formed vertically therethrough to allow the lift pin to ascend and descend along the pin hole, a ceramic puck configured to allow the substrate to be seated thereon, a base plate configured to support the ceramic puck, a bonding layer configured to bond the ceramic puck to the base plate, and an insulating pipe mounted on an inner side wall of the pin hole. The insulating pipe includes an upper insulating pipe bonded to the ceramic puck and a lower insulating pipe adhered to the base plate.