Electrostatic Chuck Plug Sealing for Discharge Prevention

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Solution Overview

Problem

In semiconductor manufacturing apparatus members, the permeation of adhesive slurry through air permeable plugs can lead to incomplete sealing, resulting in discharge between the wafer and the formation of discharge marks, which can damage the wafer and generate particles.

Innovation Solution

A semiconductor manufacturing apparatus member with an insulating electrostatic chuck and a conductive cooling plate, featuring a porous air permeable plug with a dense layer to prevent adhesive slurry permeation, ensuring complete filling of the plug chamber with an adhesive layer and blocking discharge paths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If adhesive slurry is applied to the outer peripheral surface of the air permeable plug, then the air permeable plug can be fixed in the non-through hole, but the adhesive slurry permeates the outer peripheral surface of the air permeable plug, resulting in incomplete filling of the adhesive layer and formation of a space penetrating from the electrostatic chuck side to the cooling plate side

Engineering Contradiction:

Improveease of fixing air permeable plugVSAvoidsealing reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The invention uses a porous insulating air permeable plug that allows gas permeation while providing a structure for adhesive layer formation. The porous structure enables the adhesive slurry to be retained on the surface rather than permeating through, while still allowing gas flow when needed. This resolves the contradiction by enabling both easy fixing and reliable sealing.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The adhesive layer acts as an intermediary substance between the air permeable plug and the plug chamber wall. It provides both mechanical fixation and sealing functions, preventing the formation of spaces that would allow discharge while maintaining the air permeability of the plug itself. This mediator enables simultaneous achievement of ease of manufacture and reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If a space is formed in the adhesive layer from the electrostatic chuck side to the cooling plate side, then the assembly process is simplified, but discharge occurs between the wafer, forming discharge marks that damage the wafer and generate particles

Engineering Contradiction:

Improveassembly complexityVSAvoiddischarge damage to wafer

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The adhesive layer is designed as a consumable sealing element that permanently fills and seals the space between the air permeable plug and the plug chamber wall during assembly. Once applied, it remains as a permanent seal that prevents discharge paths, sacrificing its own structural integrity to achieve the sealing function and prevent wafer damage.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The invention converts the potential harm of adhesive slurry permeation into a benefit by controlling the permeation to create a dense adhesive layer that seals discharge paths. The same porosity that allows gas flow is used to allow adhesive penetration and formation of a sealing layer, turning what would be a defect into a functional sealing mechanism.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents discharge between the wafer by ensuring a stable adhesive layer fills the space between the plug and the chamber walls, preventing damage and particle generation.

Implementation Method 1

at least a part of a surface of the air permeable plug that contacts the adhesive layer is a dense layer... the adhesive slurry is less likely to permeate the air permeable plug

Methodology Applied

Scientific EffectPermeation resistance: Permeation

Implementation Method 2

an adhesive layer filled between the dense layer and the wall surface of the plug chamber

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 3

a porous insulating air permeable plug disposed in the plug chamber

Methodology Applied

Scientific EffectPorosity: Porosity

Data Source

PatentUS11424150B2Semiconductor manufacturing apparatus member and method for manufacturing the same

Publication Date: 2022.08.23 NGK INSULATORS LTD

AI summary

A semiconductor manufacturing apparatus member in which an insulating electrostatic chuck having a wafer placement surface and provided with a narrow hole and a conductive cooling plate provided with a gas supply hole are bonded together, the member includes a plug chamber composed of at least one of an electrostatic chuck side recess and a cooling plate side recess, a porous insulating air permeable plug disposed in the plug chamber, an annular dense layer provided on the surface of the air permeable plug so as to separate the surface of the air permeable plug into a narrow hole side surface and a gas supply hole side surface and an adhesive layer filled between the dense layer and the wall surface of the plug chamber.