Electrostatic Chuck Gas Outlets to Prevent Polymer Deposition
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Solution Overview
Problem
The deposition of polymers on the surface of an electro-static chuck during plasma treatment in substrate processing leads to reduced heat efficiency and structural and functional issues, including arcing and degradation of the adhesive layer.
Innovation Solution
A gas spraying apparatus is integrated into the substrate treating apparatus, which sprays an inert gas through outlets formed between the plates of the electro-static chuck to prevent polymer deposition and protect the adhesive layer from process gases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If plasma treatment is performed using a showerhead unit, then substrate treatment is achieved, but polymer is deposited on the electro-static chuck surface
Solution Approach 1:
The gas spraying apparatus sprays a protective gas (such as nitrogen or argon) onto the electro-static chuck surface before polymer can deposit during plasma treatment. This preliminary protective action prevents polymer adhesion by creating a gas barrier between the plasma environment and the chuck surface.
Solution Approach 2:
A protective gas is introduced as an intermediary substance between the plasma process and the electro-static chuck. This intermediary gas layer blocks direct contact between polymer-containing plasma and the chuck surface, preventing deposition while allowing the plasma treatment to proceed.
2Reliability
If the electro-static chuck is used to fix the substrate, then substrate positioning is achieved, but heat efficiency deteriorates due to polymer deposition
Solution Approach 1:
The protective gas spraying system prevents polymer deposition on the electro-static chuck surface before it can accumulate and interfere with heat transfer. By continuously or periodically spraying the protective gas during plasma treatment, the chuck surface remains clean and maintains its thermal conductivity.
3Productivity
If plasma treatment continues for extended periods, then production output increases, but adhesive layer degradation and arcing occur
Solution Approach 1:
The protective gas acts as a mediator that shields the adhesive layer from direct exposure to reactive plasma species. This intermediary gas layer prevents chemical degradation of the adhesive bonding the electro-static chuck components, enabling extended operation without failure.
Solution Approach 2:
The gas spraying apparatus performs preliminary protection of the adhesive layer before plasma damage can occur. By maintaining a protective gas atmosphere around the electro-static chuck throughout the plasma treatment process, the system prevents cumulative degradation that would lead to arcing and failure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents polymer accumulation on the electro-static chuck, maintaining heat efficiency, reducing arcing, and extending the lifespan of the chuck by blocking process gases, thereby enhancing the durability and yield of semiconductor products.
Implementation Method 1
The electro-static chuck may adsorb the substrate by using an electro-static force to fix the position of the substrate.
Implementation Method 2
a plasma generating unit generating plasma for treating the substrate by using the first gas
Implementation Method 3
a gas spraying apparatus for spraying a second gas from a surface of the electro-static chuck to an inner space of the chamber housing
Data Source
AI summary
A gas spraying apparatus spraying a gas to prevent a polymer from being deposited on a surface of an electro-static chuck, and a substrate treating apparatus including the same are provided. The substrate treating apparatus comprises a chamber housing; an electro-static chuck supporting the substrate; a showerhead unit providing a first gas to an inner space of the chamber housing; a plasma generating unit generating plasma for treating the substrate by using the first gas; and a gas spraying apparatus for spraying a second gas from a surface of the electro-static chuck to the inner space, wherein the electro-static chuck includes: a first plate; a second plate disposed on the first plate; and an adhesive layer bonding the first plate and the second plate to each other, and the gas spraying apparatus sprays the second gas through an outlet formed between the first plate and the adhesive layer.