Electrostatic Chuck Power Rod Materials for High-Temperature Uniformity
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Solution Overview
Problem
Conventional substrate supports in semiconductor manufacturing face challenges such as material oxidation, increased resistance, hot spot generation, and structural integrity issues due to high processing temperatures and the use of materials like nickel.
Innovation Solution
The development of substrate support assemblies that incorporate a power transmission rod made from refractory metals or alloys, such as tantalum or tungsten-copper, with specific thermal expansion coefficients and resistivity characteristics, along with an embedded heater and electrode within an electrostatic chuck body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional materials like nickel are used in substrate support assemblies, then ease of manufacture is improved, but reliability deteriorates due to material oxidation and increased resistance at high temperatures
Solution Approach 1:
The patent applies composite materials by using refractory metals (tantalum, tungsten) and their alloys (tungsten-copper) in the power transmission rod and electrode components. These materials provide both high-temperature reliability and acceptable manufacturability through established metallurgical processes like brazing and sintering.
Solution Approach 2:
The patent changes the material parameters by selecting refractory metals with specific properties: low coefficient of thermal expansion (less than 10×10^-6/°C) and low resistivity (less than 15×10^-8 Ω-m). This parameter optimization ensures reliability at high temperatures while maintaining manufacturability.
2Device complexity
If conventional materials are used in substrate support assemblies, then device complexity is reduced, but object-generated harmful factors increase due to hot spot generation and oxidation
Solution Approach 1:
The patent uses composite materials (refractory metals and their alloys) that inherently resist hot spot generation due to their superior thermal and electrical conductivity properties, thereby reducing harmful thermal effects without significantly increasing device complexity.
Solution Approach 2:
The patent employs materials that are resistant to oxidation and degradation at high temperatures, effectively creating components that maintain their performance over extended periods rather than degrading quickly, thus reducing the need for frequent replacement.
3Ease of manufacture
If conventional materials are used in substrate support assemblies, then ease of manufacture is improved, but structural integrity deteriorates at high temperatures
Solution Approach 1:
The patent employs composite materials (refractory metals and alloys) that maintain structural integrity at high temperatures. These materials are joined using specialized brazing techniques that preserve strength while remaining manufacturable through established industrial processes.
Solution Approach 2:
The patent selects materials with specific parameter ranges: refractory metals with melting points above 2000°C and controlled coefficients of thermal expansion. These parameter changes ensure structural integrity at high temperatures while allowing for manufacturability through controlled processing parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These assemblies provide improved structural integrity and process uniformity at high temperatures, reducing hot spot generation and maintaining sustainable substrate support during high-temperature operations.
Implementation Method 1
Internally located heating devices may generate heat within the support, and the heat may be transferred conductively to the substrate
Implementation Method 2
The power transmission rod may be characterized by a room temperature resistivity of less than or about 15×10−8 Ω-m
Implementation Method 3
The power transmission rod may include a material characterized by a coefficient of thermal expansion of less than or about 10×10−6/° C
Data Source
AI summary
Exemplary support assemblies may include an electrostatic chuck body defining a substrate support surface. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include a heater embedded within the electrostatic chuck body. The assemblies may include an electrode embedded within the electrostatic chuck body between the heater and the substrate support surface. The assemblies may include a power transmission rod coupled with the electrode. The power transmission rod may include a material characterized by a coefficient of thermal expansion of less than or about 10×10−6/° C.