Electrostatic Chuck Pressure Balancing for Bonded Layer Stability
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Solution Overview
Problem
The pressure difference between the inner chamber and the accommodation chamber in a semiconductor reaction chamber causes damage to the adhesion between the base body and the functional layer of the electrostatic chuck, affecting the connection reliability and service life.
Innovation Solution
A pressure adjustment device, comprising an air extraction device and an air inflation device, is used to balance the pressure in the accommodation chamber with the inner chamber, preventing damage to the adhesion between the base body and functional layer by equalizing pressures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrostatic chuck structure with wiring channels is used to enable functional wire connection, then the electrical connectivity and temperature control are improved, but the pressure difference between inner chamber and accommodation chamber damages the adhesion between base body and functional layer
Solution Approach 1:
A pressure balance hole is introduced as an intermediary element to equalize the pressure between the inner chamber and the accommodation chamber. This pressure balance hole communicates both chambers, allowing pressure equalization that prevents the pressure difference from damaging the adhesive layer while preserving the functional wire connection through the wiring channels.
2Ease of manufacture
If the functional layer covers the wire channel opening to form accommodation chamber, then the wire connection is protected and organized, but the pressure difference acts on the bonded interface causing delamination
Solution Approach 1:
The pressure balance hole serves as a mediator that equalizes pressure across the bonded interface. By providing a communication path between the inner chamber and accommodation chamber, it prevents pressure differential from acting on the adhesive layer, thereby maintaining bonded interface stability while preserving the protective coverage of the functional layer over the wire channel opening.
Data Source
AI summary
A method for a semiconductor reaction chamber includes monitoring a first pressure in an inner chamber, monitoring a second pressure in an accommodation chamber, and in response to detection of a pressure difference between the first pressure and the second pressure greater than a threshold value, balancing the first pressure and the second pressure. The inner chamber is arranged for processing a workpiece. An electrostatic chuck is disposed in the inner chamber for placing the workpiece and includes a functional layer and a base body. The functional layer is fixed on the base body. The accommodation chamber is arranged under the functional layer and enclosed by the functional layer and the base body. A functional wire is disposed in the accommodation chamber and connected with the functional layer. The accommodation chamber is isolated from the inner chamber.