Electrostatic Chuck Protrusion Geometry for Thermal Stability
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Solution Overview
Problem
Electrostatic chuck devices face issues with thermal conduction changes due to abrasion of protrusions, leading to inconsistent temperature control of plate-like specimens during semiconductor manufacturing processes.
Innovation Solution
The electrostatic chuck device features ceramic sintered body protrusions with a cross-sectional area that gradually increases vertically downward, maintaining a controlled contact area and surface roughness to prevent abrasion-induced changes in thermal conduction, using materials like aluminum oxide-silicon carbide composite sintered bodies and optimizing the shape and size of protrusions to ensure stable temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protrusions are inclined toward the apex to support plate-like specimens, then the contact area increases for better support, but thermal conduction changes due to abrasion make temperature control impossible
Solution Approach 1:
The invention changes the geometric parameters of the protrusion by controlling the cross-sectional area ratio at different heights. Specifically, the cross-sectional area at 0.6 μm from the lower end of the top surface is designed to be 110% or less of the cross-sectional area at the lower end, creating a specific gradient profile that prevents contact area expansion during abrasion while maintaining adequate support function.
Solution Approach 2:
The invention uses ceramic sintered bodies as the material for protrusions, which provides high hardness, wear resistance, and stable thermal conduction characteristics. The ceramic material resists abrasion better than traditional materials, maintaining its geometric shape and contact area over extended service periods.
2Strength
If protrusions are made with larger cross-sectional area for better support, then mechanical strength increases, but thermal conduction characteristics change over time due to abrasion
Solution Approach 1:
The invention optimizes the cross-sectional area distribution along the protrusion height by setting specific ratio constraints. The cross-sectional area at 0.6 μm from the lower end of the top surface is designed to be 110% or less of the cross-sectional area at the lower end, creating a controlled gradient that balances mechanical strength with abrasion resistance.
Solution Approach 2:
The invention performs preliminary design of the protrusion geometry with precise cross-sectional area ratios before the abrasion problem occurs. By pre-establishing the optimal shape profile during manufacturing, the protrusion is designed to resist contact area expansion from the outset, preventing thermal conduction changes before they can affect temperature control reliability.
3Productivity
If protrusions are repeatedly used for adsorbing and releasing specimens, then productivity increases, but abrasion of protrusions causes contact area increase and thermal conduction changes
Solution Approach 1:
The invention performs preliminary design of the protrusion geometry with precise cross-sectional area ratios before the abrasion problem occurs. By pre-establishing the optimal shape profile during manufacturing, the protrusion is designed to resist contact area expansion from the outset, preventing thermal conduction changes before they can affect temperature control reliability.
Solution Approach 2:
The invention changes the geometric parameters of the protrusion by controlling the cross-sectional area ratio at different heights. Specifically, the cross-sectional area at 0.6 μm from the lower end of the top surface is designed to be 110% or less of the cross-sectional area at the lower end, creating a specific gradient profile that prevents contact area expansion during abrasion while maintaining adequate support function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively stabilizes thermal conduction characteristics, preventing increases in contact area and ensuring consistent temperature control of plate-like specimens, even after protrusion abrasion, thereby maintaining precise temperature management during semiconductor processing.
Implementation Method 1
a plurality of protrusions supporting the plate-like specimen are provided on the placement surface... an electrostatic adsorption electrode that adsorbs a plate-like specimen
Implementation Method 2
cooling gas is introduced toward a lower surface side of the plate-like specimen... the plate-like specimen is maintained at a constant temperature due to the flux of the cooling gas
Data Source
AI summary
An electrostatic chuck device that adsorbs a plate-like specimen with an electrostatic adsorption electrode and cools the plate-like specimen, including an electrostatic chuck portion, a forming material of which is a ceramic sintered body, and that has one main surface that is a placement surface on which the plate-like specimen is placed, in which a plurality of protrusions supporting the plate-like specimen are provided on the placement surface, the protrusion has a top surface that is in contact with the plate-like specimen and supports the plate-like specimen, and has a cross-sectional area that gradually increases vertically downward from a height position of the top surface, and a cross-sectional area at a distance 0.6 μm vertically downward from a lower end of the top surface of the protrusion is 110% or less of a cross-sectional area of a lower end of the top surface.