Electrostatic Chuck Radial Temperature Tuning

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Solution Overview

Problem

Existing electrostatic chuck assemblies lack the ability to control temperature profiles across substrates with abrupt temperature gradients between heating zones, which is necessary for optimizing processing conditions in semiconductor wafer manufacturing.

Innovation Solution

An electrostatic chuck assembly with a pedestal thermal control system, inner and peripheral heating electrodes, and a control system to adjust the temperature profile by varying the output of the pedestal thermal control system, heating electrodes, or gap distance between them, allowing for precise temperature gradient control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single uniform heating zone is used across the substrate, then the device complexity is reduced, but the temperature uniformity across different regions of the substrate deteriorates

Engineering Contradiction:
Improveheating zone configurationVSAvoidtemperature uniformity
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The heating system is divided into multiple independent heating zones (central heating zone and peripheral heating zones) that can be controlled separately. This segmentation allows different regions of the substrate to receive customized heating, achieving uniform temperature distribution across the entire substrate surface while maintaining reasonable device complexity through modular design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different heating zones are assigned different thermal characteristics to address local heating requirements. The central heating zone and peripheral heating zones can operate at different temperatures and power levels, allowing each region to be optimized for its specific thermal needs, thereby achieving overall temperature uniformity without requiring overly complex system design.

Inventive Principle:
Principle #3Local quality

2Device complexity

If gradual temperature transitions are used between heating zones, then the device complexity is reduced, but the manufacturing precision of temperature profile control deteriorates

Engineering Contradiction:
Improvetemperature transition designVSAvoidtemperature profile control
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The temperature transition between heating zones is made dynamic and adjustable rather than fixed. The gap distance between heating zones can be modified to create different temperature gradient profiles, and the power levels of adjacent heating zones can be dynamically adjusted. This dynamic control enables precise temperature profile management while keeping the physical structure relatively simple.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The temperature profile control precision is achieved by independently adjusting multiple parameters including the gap distance between heating zones, the power output of each heating zone, and the duration of heating in each zone. By changing these parameters, the system can create abrupt or gradual temperature transitions as needed, achieving high manufacturing precision without requiring complex structural design.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If abrupt temperature gradients are implemented between heating zones, then the processing precision is improved, but the device complexity increases

Engineering Contradiction:
Improveprocessing precisionVSAvoidheating control system
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The heating system is segmented into multiple independently controllable heating zones that can be activated or deactivated based on processing requirements. This segmentation enables the creation of abrupt temperature gradients when needed for high-precision processing, while allowing the system to simplify to fewer active zones when processing precision requirements are lower, thus balancing processing precision with device complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heating control system is designed to be multi-functional, capable of producing both abrupt and gradual temperature gradients using the same physical infrastructure. By adjusting the power levels and activation states of different heating zones, the system can universally handle various processing precision requirements without requiring separate dedicated systems, thereby achieving high processing precision without proportionally increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the achievement of steep temperature gradients between heating zones, enhancing processing efficiency by maintaining uniform and adjustable temperature profiles across substrates during processing.

Implementation Method 1

The inner heating electrode defines an inner heating zone having thermal characteristics based on the output of the inner heating electrode. The peripheral heating electrode defines a peripheral heating zone having thermal characteristics based on the output of the peripheral heating electrode.

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

The clamping electrodes are used to generate an electrostatic clamping force for holding the substrate onto the top surface of the electrostatic chuck.

Methodology Applied
Scientific EffectElectrostatic force: Electrostatics

Implementation Method 3

a pedestal support having a pedestal thermal control system adapted to provide a pedestal thermal zone having thermal characteristics based on the output of the pedestal thermal control system

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8405005B2Electrostatic chuck system and process for radially tuning the temperature profile across the surface of a substrate
Publication Date: 2013.03.26 MATTSON TECHNOLOGY INC
  • US8405005B2 patent drawing
  • US8405005B2 patent drawing
  • US8405005B2 patent drawing

AI summary

An electrostatic chuck system for maintaining a desired temperature profile across the surface of the substrate is disclosed. The electrostatic chuck system includes a pedestal support defining a substantially uniform temperature profile across the surface of the pedestal support and an electrostatic chuck supported by the pedestal support. The electrostatic chuck has a clamping electrode and a plurality of independently controlled heating electrodes. The independently controlled heating electrodes include an inner heating electrode defining an inner heating zone and a peripheral heating electrode defining a peripheral heating zone separated by a gap distance. The temperature profile across the surface of the substrate can be tuned by varying thermal characteristics of the pedestal thermal zone, the inner heating zone, the peripheral heating zone, or by varying the size of the gap distance between the inner heating electrode and the peripheral heating electrode.