Electrostatic Chuck Heat Radiation Plate

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Solution Overview

Problem

Existing electrostatic chucking devices with ceramic substrates experience uneven heat transfer, leading to temperature variations and potential cracking or fracture during semiconductor manufacturing processes.

Innovation Solution

An electrostatic chucking device featuring a plate-like body made of corrosion-resistant ceramic with a circular insulation member and a heat radiation plate on the base stage, ensuring uniform heat transfer and preventing cracking or fracture.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a ceramic substrate is used in the electrostatic chucking device, then the device can maintain structural integrity and electrical insulation, but uneven heat transfer occurs causing temperature variations and potential cracking

Engineering Contradiction:

Improvestructural integrityVSAvoidtemperature uniformity

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent applies local quality by providing a heat radiation plate specifically at the position where heat accumulation occurs (the back surface of the plate-like body). This localized heat radiation structure addresses the temperature uniformity problem only where needed, without changing the entire ceramic substrate structure. The heat radiation plate has higher thermal conductivity than the ceramic substrate, creating a local heat dissipation pathway that balances the temperature distribution.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent uses composite materials by combining the ceramic plate-like body with a heat radiation plate made of different material (having higher thermal conductivity). This composite structure leverages the electrical insulation and structural integrity of ceramic while adding the thermal management capabilities of the heat radiation plate material, solving both reliability and temperature uniformity requirements.

Inventive Principle:

Principle #40Composite materials

2Reliability

If a ceramic substrate is used in the electrostatic chucking device, then the device can provide electrical insulation, but thermal stress concentration causes cracking and fracture

Engineering Contradiction:

Improveelectrical insulationVSAvoidresistance to thermal stress

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The heat radiation plate acts as an intermediary element between the ceramic plate-like body and the heat source. It mediates the thermal stress by providing a thermal buffer that prevents direct heat concentration on the ceramic substrate, thereby reducing thermal stress concentration and preventing cracking while maintaining the ceramic's electrical insulation properties.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the thermal conductivity parameter by introducing a heat radiation plate with higher thermal conductivity than the ceramic substrate. This parameter change allows heat to be more evenly distributed, reducing thermal gradients and the resulting thermal stress that causes cracking in the ceramic material.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables uniform heat transfer and rapid heat dissipation, preventing cracking or fracture in the electrostatic chucking device, thereby improving the consistency and reliability of semiconductor manufacturing processes.

Implementation Method 1

an electrostatic adsorption electrode (12) provided in the plate-like body (11)

Methodology Applied

Scientific EffectElectrostatic adsorption: Electrostatics

Implementation Method 2

a heat radiation plate (34) provided on a principal surface (31a) of the base portion (31)

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

since heat was unevenly transferred in the ceramic substrate, there was a problem in that the surface temperature of a plate-like specimen

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9287156B2Electrostatic chucking device

Publication Date: 2016.03.15 SUMITOMO OSAKA CEMENT CO LTD

AI summary

The electrostatic chucking device 1 of the invention includes an electrostatic chucking portion 2 which includes a plate-like body 11, a top surface 11a of which is used as a mounting surface that mounts a plate-like specimen W, an electrostatic adsorption electrode 12 provided in the plate-like body 11 and a power-feeding terminal 13 that applies a direct-current voltage to the electrostatic adsorption electrode 12; and a base portion 31 that supports the electrostatic chucking portion 2, in which the plate-like body 11 is a corrosion-resistant ceramic, a circular insulation member 21 is provided in a circumferential edge portion between the electrostatic chucking portion 2 and the base portion 31, and a heat radiation plate 34 is provided on the top surface 31a of the base portion 31.