Electrostatic Chuck Cooling with Low-Emissivity Radiation Shielding
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Solution Overview
Problem
The existing substrate processing apparatuses face challenges in maintaining consistent film quality due to prolonged cooling times and heat accumulation, which affects productivity and film quality, especially when transitioning between substrate processing cycles.
Innovation Solution
The substrate processing apparatus incorporates a refrigeration device with a lifting mechanism and peripheral members coated with low emissivity materials to enhance cooling efficiency, reducing radiant heat transfer and shortening the recovery time between processing cycles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a refrigeration device is used to cool the stage to low temperature, then film quality is improved, but cooling time becomes prolonged and productivity decreases
Solution Approach 1:
The patent converts the harmful radiant heat from the processing chamber walls into a beneficial effect by coating these walls with low-emissivity material. This reflection of thermal radiation toward the cold stage enhances the cooling effect, turning what would normally be a heat source into a cooling assistant, thereby reducing cooling time without compromising film quality
Solution Approach 2:
The patent changes the emissivity parameter of the processing chamber walls by applying low-emissivity coatings. This parameter change modifies the thermal radiation characteristics of the chamber, reducing heat transfer to the stage and accelerating the cooling process, thus improving productivity while maintaining the required low temperature for film quality
2Manufacturing precision
If the stage is cooled to extremely low temperature for film formation, then film quality is improved, but heat accumulation occurs between cycles and recovery time increases
Solution Approach 1:
The low-emissivity coating on the processing chamber walls reflects thermal radiation back toward the cold stage, converting the normally harmful radiant heat into a beneficial cooling effect. This accelerates both the initial cooling and the recovery between cycles, reducing heat accumulation and minimizing recovery time while maintaining film quality
Solution Approach 2:
The patent maintains continuous cooling effectiveness by using the reflected thermal radiation to continuously remove heat from the stage. This continuous useful action prevents heat accumulation between processing cycles, ensuring the stage rapidly returns to the required low temperature for the next film formation process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the recovery time for the stage temperature, improving productivity and maintaining consistent film quality by increasing the cooling efficiency between the refrigeration device and the stage, allowing for faster temperature return to the set low temperature.
Implementation Method 1
a stage having an electrostatic chuck configured to attract and hold a substrate inside the processing container
Implementation Method 2
a refrigeration device arranged at a loser side of the stage and configured to cool the electrostatic chuck while being in contact with or be separated from the stage
Implementation Method 3
a peripheral member provided around the refrigeration device and coated with a material having lower emissivity than a base material of the peripheral member
Data Source
AI summary
A substrate processing apparatus includes a processing container, a stage having an electrostatic chuck that attracts and holds a substrate inside the processing container, the stage being configured to be rotatable, a refrigeration device arranged at a lower side of the stage and configured to cool the electrostatic chuck while being in contact with or be separated from the stage, a lift device configured to vertically move the refrigeration device, and a peripheral member provided around the refrigeration device and coated with a material having lower emissivity than a base material of the peripheral member.