Electrostatic Chuck Baseplate Recess for Discharge Suppression

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Solution Overview

Problem

Existing substrate fixing devices fail to effectively suppress discharge when using a thin electrostatic attraction member due to insufficient recess depth, leading to potential electrical discharges.

Innovation Solution

A substrate fixing device design featuring a baseplate with a through hole and a counterbore-like recess, combined with an insulating film and an insulation sleeve, which increases the distance between the electrode pin and the baseplate, reducing the likelihood of discharge.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a thin electrostatic attraction member is used, then the device complexity is reduced and manufacturing is easier, but the recess depth becomes insufficient leading to discharge

Engineering Contradiction:
Improveelectrostatic attraction member thicknessVSAvoiddischarge suppression
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The invention transitions from a two-dimensional flat baseplate structure to a three-dimensional structure by adding a recess. This dimensional change allows the electrode pin connection to be positioned deeper within the baseplate, increasing the distance to the attraction electrode and suppressing discharge while maintaining a thin electrostatic attraction member.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The recess acts as an intermediary structural element between the electrode pin connection and the attraction electrode. It provides additional insulation distance and electrical separation, enabling reliable discharge suppression without requiring a thicker electrostatic attraction member.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the distance between electrode pin connection and baseplate is increased, then discharge is suppressed, but the device structure becomes more complex

Engineering Contradiction:
Improvedischarge suppressionVSAvoidbaseplate structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The recess is integrated directly into the baseplate structure, merging the insulation function with the baseplate itself. This eliminates the need for separate insulation components while achieving the required electrical separation distance for discharge suppression.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The recess creates a localized structural variation in the baseplate only where needed for electrical separation. The rest of the baseplate maintains its original simple structure, allowing discharge suppression without globally increasing device complexity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively suppresses discharge even with thin electrostatic attraction members, extending the service life of the device by providing enhanced insulation and electrical separation.

Implementation Method 1

an electrostatic attraction member which is provided over a surface of the baseplate and includes an attraction electrode

Methodology Applied
Scientific EffectElectrostatic attraction: Electrostatics

Data Source

PatentUS11961754B2Substrate fixing device
Publication Date: 2024.04.16 SHINKO ELECTRIC IND CO LTD
  • US11961754B2 patent drawing
  • US11961754B2 patent drawing
  • US11961754B2 patent drawing

AI summary

A substrate fixing device includes a baseplate, an electrostatic attraction member, and an electrode pin. The baseplate includes a metallic member in which a through hole is famed. The electrostatic attraction member is over a surface of the baseplate and includes an attraction electrode. The electrode pin is inserted through the through hole to be connected to the attraction electrode. A recess communicating with the through hole is formed in the surface of the metallic member with the through hole being within the recess in a plan view from a direction perpendicular to the surface of the metallic member.