Electrostatic Chuck Recess for Plasma Particle Reduction
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Solution Overview
Problem
Existing substrate temperature control fixing apparatuses using electrostatic chucks face issues with particle generation due to exposure of silicon-based bonding layers to plasma, leading to contamination of substrates during high-precision semiconductor manufacturing.
Innovation Solution
A substrate temperature control fixing apparatus with a cylindrical dielectric base body and a bank portion on the base plate's periphery, eliminating the need for a protective layer by minimizing exposure of bonding layers to plasma, and incorporating a heating unit and gas path for efficient temperature control and inert gas introduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective layer is provided to prevent bonding layer exposure to plasma, then the bonding layers are protected from corrosion, but the protective layer itself deteriorates in plasma and generates particles
Solution Approach 1:
The patent removes the protective layer entirely and instead extracts the bonding layers from plasma exposure by positioning them inside a recessed region of the electrostatic chuck. The bonding layers are located in a groove or recess that prevents plasma from reaching them, eliminating the source of particle generation while maintaining structural integrity
Solution Approach 2:
The patent introduces a recessed region or groove structure as an intermediary barrier between the plasma environment and the bonding layers. This recessed structure acts as a physical shield that prevents plasma contact with the bonding layers without requiring an additional protective coating material
2Force
If the contact area of the electrostatic chuck and substrate is increased to obtain sufficient adsorbing force, then the adsorbing force is sufficient, but the device complexity increases
Solution Approach 1:
The patent concentrates the adsorbing function in a specific localized region by providing a recessed area on the electrostatic chuck surface that directly receives and adsorbs the substrate. This recessed region creates a focused contact area that maximizes adsorbing force efficiency without requiring the entire chuck surface to be involved, thereby reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces particle generation and contamination, enhancing the reliability of substrate temperature control in plasma environments by preventing bonding layer exposure and improving thermal conductivity.
Implementation Method 1
When a predetermined voltage is applied, an adsorbing target (not shown) such as a substrate is adsorbed and held onto an upper surface 102a of the base body 102
Implementation Method 2
The heating unit 106 generates a heat by an application of a voltage and controls a temperature of the base body 102 through the bonding layer 104
Data Source
AI summary
A substrate temperature control fixing apparatus comprises an electrostatic chuck which includes a base body and adsorbs and holds an adsorbing target mounted on one of surfaces of the base body, a base plate which supports the electrostatic chuck, and a bank portion provided on an outer periphery of one of surfaces of the base plate which is opposed to the other of the surfaces of the base body.