Electrostatic Chuck Recovery Circuit for Interlock Temperature Hold
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Solution Overview
Problem
Plasma processing apparatuses face challenges in protecting electronic devices during interlock mechanisms, as the sudden stop of power supply can lead to rapid temperature drops in the processing chamber, potentially damaging equipment.
Innovation Solution
Incorporating a recovery circuit connected between the second heater element and the control elements, which supplies power based on temperature readings to maintain a stable environment within the plasma processing chamber, preventing rapid temperature changes during interlock operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the interlock mechanism stops power supply to the plasma processing chamber when an abnormality occurs, then the safety and reliability of the plasma processing apparatus is improved, but the temperature in the processing chamber drops rapidly which can damage electronic devices
Solution Approach 1:
The recovery circuit is pre-configured with power storage elements (capacitors) that are charged during normal operation. When the interlock mechanism activates and main power is cut, these pre-charged capacitors immediately begin discharging to maintain temperature, preventing the harmful temperature drop before it can occur
Solution Approach 2:
The power storage elements act as a buffer or cushion that absorbs the shock of sudden power interruption. By storing energy in advance, the system creates a protective cushion that maintains temperature during the transition period when main power is cut, preventing damage to electronic devices
2Object-affected harmful factors
If the power supply is suddenly stopped during interlock operation, then the harmful effects of abnormal conditions are eliminated, but the rapid temperature change can damage electronic devices installed in the plasma processing apparatus
Solution Approach 1:
The power storage elements serve as an intermediary between the main power supply and the heater element. When main power is cut during interlock operation, the capacitors mediate the power delivery, continuing to supply current to the heater to maintain temperature, thus protecting electronic devices from temperature-related damage
3Reliability
If a recovery circuit with power storage elements is added to maintain temperature during interlock operation, then the protection of electronic devices is improved, but the device complexity increases
Solution Approach 1:
The recovery circuit operates autonomously based on temperature feedback. The temperature detection element monitors the chamber temperature and automatically controls the discharge of power storage elements to maintain appropriate temperature, eliminating the need for complex external control systems during interlock operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The recovery circuit effectively maintains the operational temperature of electronic devices within the plasma processing apparatus, ensuring they operate within a recommended environment and preventing damage from sudden temperature drops.
Implementation Method 1
a second heater element disposed in the space; a recovery circuit electrically connected between the second heater element and the at least one control element and configured to supply power to the second heater element based on a temperature in the space
Implementation Method 2
a base disposed in the plasma processing chamber and having a heat transfer medium flow path and a space
Data Source
AI summary
An electronic device installed in a plasma processing apparatus is protected during an operation of an interlock mechanism of the plasma processing apparatus. A plasma processing apparatus includes: a plasma processing chamber; a base disposed in the plasma processing chamber and having a heat transfer medium flow path and a space; an electrostatic chuck disposed on the base; a first heater element disposed in the electrostatic chuck; a second heater element disposed in the space; a control circuit substrate disposed in the space and including at least one control element electrically connected to at least one of the first heater element and the second heater element; and a recovery circuit electrically connected between the second heater element and the at least one control element and supplying power to the second heater element based on a temperature in the space.